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SMTA International 2000 Preview
December 31, 1969 |Estimated reading time: 6 minutes
SMTA International (SMTAI) will be held September 24 to 28, 2000, at the Donald Stephens Convention Center (formerly Rosemont Convention Center) in Rosemont (Chicago), Ill. Dedicated solely to surface mount, advanced packaging and related technologies, SMTAI is an event featuring a comprehensive technical conference and special symposiums. The 2000 event will be co-located with Assembly Technology Expo (ATExpo), an all-assembly exhibition and technical conference. Exhibit hall G, the Electronics Assembly Pavilion (EAP), will be dedicated to demonstrating surface mount assembly technology.
Conference
SMTAI's comprehensive conference features more than 150 technical papers, 32 tutorials and workshops given by industry experts across six tracks: manufacturing and assembly, soldering, process control, substrates, contract manufacturing/business, and advanced packaging.
Tutorials are full-day (7 hour) and half-day (3.5 hour) educational programs led by industry professionals with extensive experience in the course's subject area. Course leaders deliver in-depth presentations based on their research and industry experience. Tutorials are application oriented and structured to combine field experience with scientific research to solve everyday problems. Tutorials are offered on Sunday, Monday and Thursday.
Some of the topics covered include: Surface Mount Technology: Principles and Practice; SMT Stencil Printing and Inspection; Ball Grid Array (BGA) Design and Assembly Considerations; Solder Flux Choices: Process and Reliability Considerations; Solder Joint Reliability of BGA, Flip Chip and Chip Scale Assemblies; Process Control for BGA/Chip Scale Package (CSP) Manufacture; Keys to Success for Optimizing the Contract Manufacturing Partnership; BGA and CSP Rework: Theory, Methods and Applications; Printed Circuit Board (PCB) Design Principles for BGA and CSP Technology; New and Emerging Technologies for Electronic Packaging and Assembly; Lead-free Solders Year 2000 and Beyond; and Troubleshooting SMT Yield Problems.
Technical sessions are 1.5-hour programs featuring three technical papers presented under the direction of a chairman. Each paper is presented by the author on a topic related to the session's main subject and is followed by audience questions. Technical sessions are organized by track and by day within each track. Some topics covered include: Design for Excellence; Printing and Stencil Technology; Vision Placement Methodologies; 0201 Placement; Improved Flip Chip Materials and Processes; BGA with Lead-free Interconnect; BGA Reliability; BGA and CSP Issues; Lead-free Soldering; Reliability of Lead-free Electronics; Test and Inspection: Effective Process Control Strategies; Quality, Cost and the Critical Role of Process Control; Alternate Surface Finishes for Today's Electronics; Doing Business in a Global Marketplace; Panel Discussion: OEM/ODM/CEM Morphing: Will the Pendulum Reverse Its Swing?; MEMS Technology Trends and Reliability; CSP Reliability; and Profitability and the Engineering Manager.
Workshops offered include: Evaluating and Purchasing SMT Assembly Equipment, and SPC and Troubleshooting Methods.
Special Events
SMTAI offers many opportunities for attendees to gain new skills and update technical knowledge. Some events require fees and advance registration.
The Contract Manufacturing Symposium, held Monday, September 25, from 8:30 a.m. to 5 p.m. in Room 25, is organized by Greg Reed, chief editor, SMT Magazine, with panel organization by Ralph Kenton, Ralph Kenton & Associates and SMT editorial advisory board member. As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTAI provides the skills and information needed to form profitable relationships.
The Opening Session, Tuesday, September 26, 8:30 to 10 a.m. in Room 13-14, features the Surface Mount Council Presentation: SMC 101 Action Plan for Survival. The Council has undertaken an analysis and comparison of the national electronics roadmaps. This presentation will provide a summary of that analysis and describe the "state of the industry." The changing paradigm of manufacturing and supply will be described. Details on the impact of this new paradigm on EMS companies, OEMs, and substrate and packaging suppliers will be covered as well as proposed "action items" for industry, government and academia.
The presenters for this analysis will be: Martin Freedman, Molex, Overview of SMC 101; Vern Solberg, Solberg Manufacturing Technology, and Greg Munie, Lucent Technologies, OEM Overview; Jack Fisher, ITRI, Substrate Manufacturing; and Mark Bird, Amkor Technology, Electronic Packaging. The 1999 Conference Award Winners also will be recognized:
- Best of Conference Presentation Lavanya Gopalaskrishnan, Bay Networks
- Best Proceedings Paper Marie Cole, IBM Microelectronics
- Best International Paper Malcolm Warwick, Multicore Solders.
SMTA Annual Meeting/Keynote Luncheon will be held Tuesday, September 26, from 12 to 1:30 p.m. in Room 13-14. George Duncan of Delco Electronics will be the keynote speaker, presenting "A Brief Glimpse of the Future of Vehicle Electronics." With the advent of new "smart car" technologies like drive, brake and steer by wire; collision avoidance; mobile media; Onstar; GPS navigation systems; integrated cockpits; radar voice interface; and heads-up displays, the vehicles produced over the next 10 to 15 years will have substantially more electronic content than today's vehicles. New components, substrates, assembly processes and final packaging will have to be developed to bring the smart-car vision to reality.
This keynote address will give attendees a glimpse of what the future of vehicle electronics might be and what this might mean for supporting technologies, the economy and customer acceptance.
George Duncan holds a BS degree in mechanical engineering, an MBA and he has completed the University of Michigan Executive Development program. During the course of his career, he has had the opportunity to experience many advanced processes and techniques related to lean manufacturing, total quality management, strategic sourcing, business improvement, business process re-engineering and strategic planning. There is a fee to attend this event and reservations are required.
The Engineering Management Business Symposium, held Tuesday, September 26, from 10:30 a.m. to 5 p.m., in Room 30, has been geared to the needs of engineering managers. Three specific sessions will focus on human resources, business productivity and profitabilty.
A Networking Reception on Tuesday, September 26, from 5 to 6:30 p.m., offers networking opportunities as well as hors d'oeuvres, wine and beer.
The Microelectromechanical Systems (MEMS) Symposium is all about the integration of just about everything motion, light, sound, molecule detection, radio waves and computation. Combine all this on a single chip and we can deliver incredible versatility for amazing new products. The symposium will be held Wednesday, September 27, from 8:30 a.m. to 12:30 p.m., in Room 13.
The 0201 Placement Forum covers the growing trend of increasing product functionality, density and complexity. Component suppliers meet the challenge by creating smaller and smaller devices. This free session, held Wednesday, September 27, from 2 to 3 p.m., will focus on the assembly challenges related to the 0201 rectangular chip, which requires leading edge equipment, process definition and process control.
The BGA and CSP Issues Panel of industry experts, made up of package and semiconductor suppliers, contract manufacturers (CM), OEMs, and research organizations, will address current issues surrounding the use, reliability, and characteristics of BGA and CSP packages.
Held Wednesday, September 27, from 3:30 to 5 p.m. in Room 10, future technology trends, such as the impending transition to lead-free interconnect and the further miniaturization of CSP with the advent of wafer-level packaging, will be discussed. Questions will be fielded from the audience as well as from the moderator.
The Advanced Inspection Technologies Forum focuses on optical, X-ray and acoustic technologies and their application to SMT inspection. On Thursday, September 28, from 8:30 a.m. to 12 p.m. in Room 11, papers will be presented by Tektronix, ViTechnology, Motorola, Cerberus Technologies, Sonoscan, Solectron and Agilent Technologies.
The EASi Line, Technology in Action, is coordinated by Electronics Manufacturing Solutions Inc. This live demonstration line will manufacture an electronic thermometer with surface mount components on both sides. The fully conveyorized manufacturing line will incorporate typical equipment, including stencil, pick-and-place, adhesive dispense and cure, reflow, wave solder, test and inspection, selective soldering, and robotic packaging processes.
The Practical Solutions Forums take place daily on the exhibit floor. These are moderated discussions targeted at key issues and challenges facing manufacturers. The forums bring users and suppliers together to confront specific technical and operational requirements causing higher cost or lower quality, yield and reliability. The objective is to identify potential solution paths and enhance customer/supplier communications.
Electronics Assembly Pavilion
The EAP is located upstairs in Hall G of the convention center and features more than 200 exhibitors with a focus on electronics assembly. This showcase for PCB assembly reportedly was visited by approximately 10,000 attendees in 1999. Michael Miller, 1999 attendee from Lucas Body Systems said, "If you can't find the hardware, tools or applications you need at this show, it must not exist."
For more information on the SMTAI conference and EAP, visit smta.org/smtai/.