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Products
December 31, 1969 |Estimated reading time: 8 minutes
Two-part Epoxy Adhesive
Tra-Duct 2958 is a two-part epoxy adhesive formulated for electronic bonding and sealing applications. It reportedly has a long pot life and short cure schedule. It will cure in 15 minutes at 100°C, 5 minutes at 125°C or 2 minutes at150°C. The adhesive is said to develop durable, void-free, electrically and thermally conducting bonds to a variety of substrates, including ceramic, metal, glass and plastic laminates. Tra-Con Inc., Bedford, Mass.
Surface Mount PPTC Device
The PolySwitch polymeric positive temperature coefficient (PPTC) SMDH160 resettable fuse is a 16 V, 1.6 A SMD that is said to provide circuit protection in temperatures as high as 125°C, which is a 40°C increase compared with previously available devices. These de vices automatically reset once the fault is cleared and the power to the circuit is removed, saving OEMs and end users the inconvenience and ex pense of locating and replacing a blown fuse. Raychem Corp., Menlo Park, Calif.
Visual Inspection Technology
This company offers visual inspection tech nology in a range of capabilities, from the SuperScope LCD vision system to the Vision Lite 2000 illuminated magnifier with patented dimmable fluorescent lighting. The system is said to be a turnkey production tool consisting of a flat LCD monitor and high-resolution camera with an integral illumination system. The illuminated magnifier re portedly features the first dimmable fluorescent illuminated magnifier and is available in either three-diopter (1.75X) or four-diopter (2X) quality crown white lens. O.C. White Co., Three Rivers, Mass.
Component Print Station
The Component Print Station is de signed for rework and repair solder paste application. This device applies paste directly onto the part rather than the board, allowing application to be performed on a bench or any convenient work surface. Unlike typical ministencil tools, which must be attached to the rework system and require stencil-to-board alignment, this station's self-alignment of the part to the stencil is said to be designed for quick, accurate and repeatable results. Sierra Research & Technology, Westford, Mass.
ADHESIVES/EPOXIES
Casting, Potting and Encapsulation
AL1900 epoxy series can be used for casting, potting and encapsulating applications. The single-component product cures at elevated temperature and is said to eliminate weighing and mixing. The two-component version cures at room temperature and is designed for use with heat-sensitive substrates. Each is available in a range of viscosities. Alfa International Corp., Woonsocket, R.I.
Die-attach Silver Epoxy
ME8418-DA is a silver epoxy die-attach adhesive designed to cure at 80° to 120°C. It is said to be ambient-storable for more than seven days without more than 10 percent deviation from the 20,000 cps viscosity. At 90°C, the bonding cycle is complete in less than 30 minutes and ready for wire bonding at temperatures as high as 250°C. AI Technology Inc., Princeton, N.J.
Adhesives
The Ableflex 5203 series of adhesives is a new line of materials designed for high-reliability, semiconductor die-attach applications. These nonconductive adhesive films are said to feature rapid film preattach to substrate, low attach temperature, rapid die attach, low stress and high thermal stability. They are said to be suitable for the latest generation of CSPs. The adhesives reportedly have a thin layer of high-purity, thermoset adhesive coated onto both sides of a high-Tg polyimide carrier, which maintains electrical isolation between bonded surfaces and provides strength. Ablestik, a National Starch & Chemical Co., Rancho Dominguez, Calif.
Electrically Conductive Adhesives
These conductive adhesives are said to meet temperature range requirements from -55° through 150°C and produce a bond that cures at room temperature. After cure, the bond or seal is flexible and waterproof. The adhesives' consistency and high conductivity reportedly permit optimum silk screening for engineering design applications. They also maintain a shelf life of up to six months. The one- and two-part adhesive sealants reportedly adapt to meet many bonding requirements. Tecknit, Cranford, N.J.
Thermally Conductive Adhesive
TC-611 is an ultra-low-stress, thermally conductive adhesive. When bonding two dissimilar materials having different CTEs, the adhesive is said to absorb the differential expansion and prevent the substrates from bending. Applications include attachment of aluminum heat sinks to flip chip ICs and attachment of stress-sensitive devices such as microelectronic sensors and micromachined sensors. Zymet Inc., East Hanover, N.J.
Silicone Potting Compound
A two-part, low-viscosity, thermally conductive RTV silicone potting compound, RTVS 3-95-1 is UL-recognized for flame class 94V-0. Its high thermal conductivity and low CTE reportedly make it suitable for potting delicate circuitry requiring high dielectric strength, heat dissipation and high operating temperatures. Typical applications include military electronic encapsulation, high-temperature transformer/power supply potting and potting power supply requiring high heat dissipation. Insulcast, Div. of American Safety Tech nologies, Roseland, N.J.
Silicone Ink
120-33 is an electrically conductive silicone ink coating and adhesive suitable for screen printing narrow circuit lines. Said to be flexible and tactile, this product is useful as a coating on silicone substrates. It reportedly features adhesion to Kapton, Mylar, glass and various other substrates. Applications include EMI/RFI shielding of flexible circuits, polymer thick-film circuitry and membrane switches. Creative Materials Inc., Tyngsboro, Mass.
Electrically Conductive Epoxy
3440 is a gold-polymer-filled, anisotropic, electrically conductive epoxy adhesive for electronic bonding applications requiring extreme conductance. Developed to replace solder on non-solderable substrates, this single-component, heat-cure epoxy is a one-part adhesive paste designed for durable electrically conductive bonds when fully cured under heat and pressure. It reportedly cures in 60 seconds at 180°C under 200 psi pressure. It is suitable for die-attach applications involving non-solderable substrates, including LCD assembly, flex circuit interconnection, smart cards, TAB interconnection, COB and COG. Loctite Corp., Rocky Hill, Conn.
Thermally Conductive Material
A thermally conductive, phase-change, pressure-sensitive adhesive material, winPhase is said to integrate the thermally conductive properties of a phase-change material with the adhesion properties of an acrylic adhesive, reportedly eliminating the need for clips and other mechanical fasteners. The material is said to be engineered for applications that demand low thermal resistance and easy application, while requiring no clips to maintain adhesion through stringent reliability testing. It reportedly requires 15 psi of applied force for 5 seconds to achieve its mechanical strength. Thermoset, Lord Chemical Products, Indianapolis, Ind.
Thermally Cured Epoxy
Optocast 3508 is the newest in the company's line of UV and thermally cured epoxies for optical and electronic device assembly. It is a single-component, high-viscosity epoxy system that is said to cure quickly and completely upon exposure to UV light. Containing no filters or particulates, the adhesive reportedly offers optimal performance while resisting moisture and thermal degradation. It also is said to feature low shrinkage upon cure, ionic content and outgassing. Electronic Materials Inc., Breckenridge, Colo.
Assembly Adhesive
OP-60 is an assembly adhesive that is said to cure in seconds upon ex posure to UV light. It reportedly minimizes movement of critical components during curing and sub sequent thermal cycling. It is said to have a CTE of 58 ppm per °C and demonstrate low expansion and shrinkage for a light-curable adhesive. The adhesive can be cured through UV-blocked plastics such as Ultem, polycarbonate and polyacrylic. The product also is said to offer moisture resistance and low outgassing. Dymax Corp., Torrington, Conn.
Epoxy
A high-temperature epoxy, Duralco 4525 is said to offer chemical, electrical and moisture resistance, even in high humidity. Once mixed and applied, the epoxy cures at room temperature to reportedly provide low moisture absorption, high bond strength, high temperature stability and low shrinkage. Applications include bonding, sealing and protecting cable-end seals, thermocouples, strain gauges, critical electronic components, electric heaters, flow meters, glass-lined tanks, and more. Cotronics Corp., Brooklyn, N.Y.
ASSEMBLY EQUIPMENT
Pin Feeder
The Surf-Shooter SMT product line is a loose pin feeder designed to mount to a flexible placement system and present SMT pins at feed rates greater than one pin per second. Parts are vibratory fed into an escapement where compressed air pushes the pin into a mechanical shuttle that presents the pin to the placement system vacuum nozzle. The unit is less than 4" wide and mounts to the placement system feeder bay. The feeder itself is a self-contained unit, 110 VAC/80 psi, typically requiring no electronic control interface with the placement machine. A programmable controller monitors pin movement from the vibratory feeder system to the vacuum nozzle. Zierick Manufacturing Corp., Mt. Kisco, N.Y.
Depaneling System
This company now offers Sony's CAST-CR1 depaneling system. The digitally controlled benchtop machine, which reportedly requires no tooling, enables shops to process multiple boards and depanel them in-house. The system's cutting head rotates at 40,000 rpm and can be programmed by a hand-held teaching device to follow any rectangular or circular path. The system is said to cut glass epoxy or paper phenol boards at speeds of up to 4" (100 mm) per second and can store up to 10 programs with up to 250 routing points. Manncorp, Huntingdon Valley, Pa.
ENVIRONMENTAL PROTECTION
Fume Extraction System Control
The Intelligent Purification Network (IPN) provides control and monitoring for up to 30 fume extraction systems from one PC.
It networks the Intelligent Purification Control Program (IPCP) software embedded in Superflow extraction machines. The machines' controls can be set from a host PC, and the status of parameters such as filter life, filtered air quality and system temperature can be monitored remotely. To provide higher safety levels, the network can be integrated into an overall process control system. If the level of extraction drops below preset safe limits, the process can be automatically shut down. Purex Fume Extraction and Purification Systems, Long Beach, Calif. SMT
FEATURE PRODUCTS
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Adapter
The BGA Flip Adapter reportedly allows designers to run their emulator or signal-access adapters through the rear side of the PCB while disabling the processor circuit soldered to the PCB's front side. This adapter mirrors a BGA's signals on the rear side of the PCB, providing signal access and the same physical pad layout that exists on the PCB's front side. The tool allows the main processor to stay intact and soldered to the front side of the PCB throughout the hardware and debug phase. Emulation Technology Inc., Santa Clara, Calif.