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High-speed PCBs Support Backplanes
December 31, 1969 |Estimated reading time: Less than a minute
SAN JOSE, Calif. - Sanmina Corp. announced the successful fabrication of high-speed PCBs to support Thomas & Betts MPI>SI backplane technology. This interconnect technology reportedly offers advantages in system speed, signal integrity, electrical performance and backplane density over conventional connector technology. It is expected to have applications in data communications and telecommunications equipment, including enterprise servers, workstations, routers, switches, and base stations.
"We are very excited to be a part of this innovate program," said Brian Nelson, Sanmina`s manager of new product introduction. "This technology offers communications equipment companies a fast, reliable interconnect system to meet the need for increased speed with exceptional signal integrity, simplicity and at a relative low cost."
The project was handled by Sanmina PWB Div.`s Corporate Technology and Engineering Group (CTE), a staff and resource dedicated to developing and furthering manufacturing capabilities.
Thomas & Betts has announced that this new PCB backplane interconnect has a signal-to-ground ratio of 8:1 and achieves signal speeds higher than 3 Gbps with no measurable crosstalk.