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IRC Expands Capabilities
December 31, 1969 |Estimated reading time: 1 minute
Resistor manufacturer IRC expanded its series of integrated passive networks to include chip scale packaging (CSP). These integrated passive networks can be configured for a wide range of line termination and electromagnetic interference (EMI)/radio-frequency interference (RFI) filtering functions that are designed to meet the demands of wireless voice and data communications applications where high-density and high-frequency performance are critical.
According to Steve Wade, director of sales and marketing at the company`s Corpus Christi, Texas, Advanced Film Div., its CSP capabilities resulted from customer demands for smaller passive network packages with lower parasitic inductance. "The higher frequencies used in today`s high-speed data communications circuits require high-density integrated passive networks to maintain signal integrity," Wade explained. "And our ability to incorporate these networks into low-profile CSPs provides circuit designers significant savings in board space."
Wade said that the key to the company`s chip scale effort was its ability to manufacture precision thin-film tantalum-nitride resistors, capacitors and diodes on silicon substrates. The extremely low-profile packaging gives the devices an ultra-short signal path, resulting in lower parasitic inductance, which reduces signal delays and ground bounce.
According to Wade, the new chip scale networks are expected to be used in filtering and termination circuits for all types of high-speed data communications lines in telecommunications, networking, computer and wireless applications.
For additional information on the CSP networks, visit the IRC`s Web site, www.irctt.com.