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Solder Paste Inspection
December 31, 1969 |Estimated reading time: Less than a minute
The SE 300 high-speed, high-resolution, 3-D solder paste inspection system is said to be capable of performing 100 percent inspection at production line speeds. It automatically measures height, volume, area and bridging, and notifies the operator if any parameters begin trending outside the user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, reportedly inspects 4 sq. inches per second; high-resolution mode, used for inspecting smaller components such as CSPs and 0402 discretes, reportedly inspects at 1.5 sq. inches per second. Both speeds can be combined in the same inspection program.
CyberOptics Corp.
Minneapolis, Minn.