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Real-time Failure Analysis
December 31, 1969 |Estimated reading time: Less than a minute
The NXR-20HR real-time failure analysis system features an 8 µ microfocus X-ray source and 300X magnification for verification and inspection of SMT PCBs using BGAs, flip chips, µBGAs and other high-density packages. As a semiautomated system, it is designed to quickly and repeatedly identify hidden defects such as shorted or open solder joints, component misregistration, and voiding or unacceptable size variations in solder bumps. The system uses 5-axis sample manipulation (rotate and tilt, and X-, Y- and Z-axis movement) for image acquisitions.
Nicolet Imaging Systems/Sierra Research & Technology
San Diego, Calif.