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CM Agreement Reached
December 31, 1969 |Estimated reading time: 1 minute
SAN JOSE, Calif. - Sanmina Corp. and Harris Corp. signed a three-year strategic manufacturing agreement. Under its terms, Harris will outsource its commercial PCB assembly manufacturing to Sanmina. In addition, Sanmina is acquiring Harris` PCB assembly manufacturing assets and inventory and will lease the company`s ISO 9002-certified, state-of-the-art manufacturing facility in San Antonio.
"The communications sector is one of our fastest growing target markets, and we are very excited about this strategic manufacturing partnership with Harris," said Jure Sola, Sanmina`s chairman and CEO. "We also welcome Harris` highly talented manufacturing engineering employees to Sanmina. With their support, we will work closely with Harris to expand their commercial communications business, especially in the development of new products.
"This acquisition also gives Sanmina the foundation for building an enhanced [CM] operation in the telecommunications corridor in the south central region of the United States. Currently, we have PCB assembly, back-plane, advanced, custom cable, harness and mechanical assembly operations in the Dallas area. With the addition of the San Antonio facility, we will be able to support our current customers and attract new customers by providing full system integration, box build and all levels of system test, especially for large volume orders," concluded Sola.
In other company news, Sanmina announced that it has been awarded Telcordia (formerly Bellcore) Certification of DuraBOND as a replacement for black oxide in the fabrication of multilayered PCBs. The company pursued this quality recognition based on the results of a comprehensive study that concluded that PCBs manufactured with McGean-Rohco`s DuraBOND conform to the criteria from GR-78, TR-357, GR-1217 and other industry standards for 25-year service life in uncontrolled environments. This analysis is Telcordia`s highest accreditation for a PCB fabrication process.