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The PlacePro Model 7100 employs six touchless centering placement heads mounted on a single gantry. It can reportedly place a wide range of component package types at rates up to 18,180 cph. A high-speed scan camera mounted on the gantry below the head assembly provides on-the-fly vision alignment of components as the gantry moves from the pick point to the placement position. Touchless component centering is performed using the high-speed vision processing system and either the scan camera or one of three optional frame-mounted cameras. Reportedly, accurate, repeatable component placement is achieved using Class 5 ball-screw driven X-Y gantry control. Each head provides independent servo-driven Z-axis control, adjustable Z-axis stroke speed and a spring compliant placement force. Component package types placed include SOIC, PLCC, TSOP, QFP, BGA, µBGA, CSP, flip chip, DCA, odd-form and SMD connectors.
San Marcos, Calif.