Short Production Runs


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MY9, the smallest footprint of the MY-Series machines, can handle up to 112 8 mm feeders, 105 SOIC tubes, or 80 8 mm tapes and 32 JEDEC trays with the optional tray exchanger. With this option and the new dual vision system, the machine is capable of placing components, QFPs, BGAs, and more advanced package technologies like flip chip, BGA and CSPs with pitch down to 0.16 mm.

MYDATA automation

Peabody, Mass.

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