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Product Review
December 31, 1969 |Estimated reading time: 48 minutes
Mobile Storage SystemThe UltraClean PureFlow mobile storage system features a self-recharging power cell and Class 10 compatibility that is said to guarantee fail-safe particle control during the transport of microelectronic components and other sensitive materials through a manufacturing facility. All systems are self-contained and incorporate a motorized impeller blower and filter that direct a continuous wash of filtered air downward throughout the storage area. Stainless-steel wire shelves reportedly ensure an uninterrupted laminar flow of clean air through the interior, chrome-plated shelving further eliminates particle shedding, and any particles that might enter the system when an access door is opened are quickly purged out the bottom. Terra Universal Inc., Anaheim, Calif.
Miniature OscillatorMeasuring 1.6 x 7 x 5 mm, the Model SMO oscillator is intended for surface mount applications in microprocessor clocks. It is available in frequency ranges from 1.5 to 80 MHz, with output loads of 15 or 50 pF, for voltage supplies of 3 to 5 V. Its washable, glass-sealed ceramic package is suited for reflow soldering up to 245°C. Rise and fall time is said to be 10 ns maximum, 6 ns typical, while stability is ±30 ppm over normal operating temperature ranges. An optional tristate gate allows the device to be disabled electronically for testing. Jauch USA, Fulton, Md.
Machine Vision InspectionIncorporating the object location technology, PatInspect machine vision software can reportedly find defects on an object even when it has been rotated or its scale has been changed from the original, trained position. It can also detect flaws along the edges of an object. In semiconductor manufacturing, a vision system with this software can inspect die, lead frames, probe marks and IC marks for defects. To discriminate between real defects and acceptable variations that result from the manufacturing process, the software employs a rule-based defect "classifier." Users can set a range of preconfigured parameters or "rules" that the vision system uses to decide whether to accept or reject a device based on defect characteristics. It can also classify defects by type, providing information to help users understand and control the manufacturing process. Cognex Corp., Natick, Mass.
Solder Bump Attachment of PGAsThis method for manufacturing a variety of PGAs reportedly eliminates coplanarity problems, faulty solder joints and special-handling issues associated with conventional butt-joint, pin-to-paste methods. This technique uses a "pin-ball" grid array methodology in which eutectic solder bumps are pre-attached to the heads of the specially designed pins, which are inserted so that the heads lie flush with the upper side of the PGA substrate. The inherent nature of the solder bumps allows them to be self-centering and self-aligning for better coplanarity and solder joint reliability. In addition, because the substrate can be made from standard FR-4, the thermal-expansioncharacteristics can be closely matched between the PGA interposer and the MCM, thereby reducing subsequent stresses during thermal cycling. Autosplice Inc., San Diego, Calif.
Standardized Lead-frameThe continuous strip Solder-Laden lead-frame is said to provide perfect solder joints when attaching leads, and enable SIP, DIP and SO packages to be manufactured with a single lead-frame. Each lead-frame has the amount of solder needed in the pad attachment area to make quality joints, reportedly eliminating the process step of screening the solder paste to the pads. The continuous strip is cut to the desired length and attached to each side of the component where needed. The lead-frames can be provided in pitches ranging from 0.010" centerline down to 0.5 mm. Clip style or flat paddle attachments are available. Die-Tech Inc., York Haven, Pa.
Rejected PCB RemovalThe Line Sentry-1 is designed to remove inspected and rejected PCBs from in-line SMT production lines. It can reside after an automated stencil printer, component insertion or 3-D inspection system. The system provides product buffering and manual visual inspect/reject, and can be programmed to stack and buffer PCBs, allowing the screen printing process to continue. Reportedly, it allows operators to service a stencil printer while the system continues to feed the production line downstream. SEMA Inc., Milford, Mass.
Feeder and Reel TransportationFeeder Carts are designed to store and transport component feeders and reels to PCB assembly lines. Feeders are reportedly held securely in place and are completely surrounded by the cart frame to prevent damage to feeder heads, reel arms and component reels from passing traffic. They can be used directly on the assembly line at a pick-and-place machine, or as a job cart to transport feeders and reels from a staging area. Adding an adjustable shelf, feeder setup rack and employee wrist strap ground plug, converts the carts into modular work centers and feeder setup carts. Bliss Industries Inc., Fremont, Calif.
Vision Inspection TechnologThe Vi-2000 AOI system is said to be capable of inspecting 100,000 components per hour at speeds upward of 2 m per second. The unit can be installed at multiple locations in an SMT production line, including: after the stencil printer, where it measures solder paste deposits; after the chipshooter to check for component placement and analyze fine-pitch solder deposits; after the fine-pitch placer to check for proper orientation of components; and after the reflow oven to inspect finished joint integrity. The system employs up to four different CCD cameras and incorporates several types of lighting, including axial centered amber, axial peripheral amber, near annual amber and near annular green, all of which are adjustable from 0 to 100 percent. ViTechnology, Haverhill, Mass.
Hand-held Thermal LabelingThe TLS2200 thermal labeling system is a hand-held thermal transfer printer with bar-code capability. It is designed to maintain the portability and ease of use offered by a hand-held printer, while providing advanced features such as high-resolution (203 dpi) thermal transfer printing, bar-code symbology and a wide variety of material configurations. The system can reportedly print application-specific bar-code labels for PCBs, components and PROM/EPROM identification, as well as bottomside applications that are directly exposed to wavesolder or mixed-technology SMT processes. It can print up to 1" per second and weighs only 2.75 lb. In addition, its ribbon design is said to allow users to quickly replace the cartridge, eliminating complicated instructions and prolonged downtime. Brady USA Inc., Milwaukee, Wis.
'Standardized' AssemblersThe Meridian Series consists of seven fully compatible SMT assembler models: 1010, 1010P, 1020, 1020P, 1030, 1030P and 1050M. The specifications for the series are reportedly expressed using the standard definitions and validation methods of the proposed IPC-9850 standard. Maximum placement rates are said to exceed 28,000 cph on some of the models. The assemblers place chip and IC components, and incorporate the full range of company electronic tape feeders and bases. Quad Systems Corp., Willow Grove, Pa.
Servo DrivesThe SCE900 Series servo drives reportedly feature a CE compliance rating and close current, velocity and position loops using a single digital signal processor (DSP). The product family offers four output power levels ranging from 7.5 to 60 A peak and 3.75 to 30 A continuous. The drives can be used alone or with option cards to increase functionality (available cards are serial interface, SERCOS interface option and programmable single-axis position control). The modular design of the family is said to increase functionality, while its open architecture reportedly ensures upgradability. Pacific Scientific, Rockford, Ill.
NozzlesFCR nozzles are designed to focus heated air on component leads while minimizing heat to adjacent areas. The "focused" heated gas control reportedly heats more directly and efficiently, resulting in reduced cycle times while preserving the integrity of the component and PCB. While designed for the company's FCR series of rework tools, an optional adapter allows these nozzles to be used with other hot-air systems. OK Industries, Yonker, N.Y.
Liquid DispenserThe Xyflex liquid dispenser uses a gantry system to achieve accurate positioning with the use of linear and rotary encoders and enclosed-loop servomotors, eliminating the X-axis drive train. It is reported to have a speed of 140,000 dots per hour. It can dispense solder paste, adhesives, conductive epoxies, encapsulants and flip chip underfill. Available with single or asynchronous dual conveyors, the dispenser comes in two models, one for surface mount assembly and one for semiconductor packaging. The dispensers incorporate software with a Windows NT operating system, a remote operator capability and graphical user interface. Speedline Technologies, Franklin, Mass.
Laser Soldering RobotThe MTA laser soldering robot uses a diode laser to reportedly provide precise, contactless soldering. The robot automates soldering for applications such as soldering connections and LEDs on switchboards; soldering surface mount components, wires and PCBs; and the soldering of integrated chips on PCBs. It uses its laser beam to heat the solder, and no water is required to cool the laser. Various laser soldering irons are available, with power ranging from 20 to 80 W. A PC-based system is used to control the laser. Global Automation Inc., Old Lyme, Conn.
Manipulation SystemThe CHADIQ manipulation system can handle odd-form, THT, and fine-pitch SMT PCB applications and small electromechanical assembly applications. It has a footprint of 48" or less. The system can be used for, but not limited to, automated screw driving, riveting and fastening, adhesive dispensing, small parts assembly, inspection, and light press operations on a single platform. CHAD, Orange, Calif.
Flip Chip Bonding SystemThe Model 860 multi-use flip chip bonding system can be configured to bond flip chips as well as laser diodes and eutectic bonded die. The bonder can align and attach die sizes from 0.006 to 1 in2 at a throughput rate of up to 200 placements per hour with placement accuracy of ±5 μm. The basic platform is loaded with standard features such as an extend/retract cube beam splitter viewing system with illuminators and precision servo motor-driven Z motion with closed-loop temperature control. Users can select one of four closed-loop bond load control ranges, starting at 5 g and going up to 10 kg. Add-ons include a dual-nozzle gas heating system for localized flip chip heating and a thermosonic bond head for small microwave flip chip bonding. Semiconductor Equipment Corp., Moorpark, Calif.
Non-contact Dispensing PlatformThe Century SMT platform has been designed for mid-range SMT adhesive dispensing applications. It offers noncontact dispensing with the DispenseJet valve, reportedly increasing speed and throughput with a repeatability of ±3 percent. Asymtek, Carlsbad, Calif.
Single-, Dual-head MountersThe Intelliplace DHM-120 (dual-head mounter) has a maximum placement rate of 10,000 cph, while the SHM-120 (single-head mounter) offers a maximum placement rate of 6,000 cph. Both systems can accommodate an inventory of up to 120 x 8 mm tape feeders, and can handle boards up to 460 x 410 mm in size. Tact time is 0.36 seconds per chip for the DHM and 0.72 seconds per chip for the SHM. Both systems feature advanced all-vision recognition for flexible and precise placement of 0402 chips to 52 mm QFPs, BGAs and odd-form devices. Options for enhanced productivity include intelligent feeder systems, bulk feeder change, matrix tray sequencing and off-line programming. MultiTroniks, Warren, N.J.
Dispensing ValveFC200 dispensing valve provides accurate dispensing on a wide variety of materials. The valve can dispense materials as thin as oils and solvents, and much thicker materials such as greases and silicones. The valve can handle assembly fluids and materials with viscosities in a range of 1 to 1,000,000 cps. Its stainless-steel fluid body design allows for fluid pressures up to 3,500 psi. The valve employs a divorced design of the air from the fluid body to ensure the elimination of fluid contamination from the valve's air section. All of the valve's material seals are Teflon. Precision Valve & Automation, Halfmoon, N.Y.
Direct Drive HeadDirect drive head technology is provided on both flexible mounters and chipshooters. The direct drive head incorporates a microstepper motor and placement head in a single unit for 360° rotation, achieving theta resolution of 0.007° with 51,200 pulses per revolution. The technology places chips from 1005s to 32 mm QFPs, at speeds as high as 0.1 seconds per component in optimal configuration. The motor eliminates more than 40 parts. Nissei Sangyo America, Irving, Texas.
Linear Positive Displacement PumpThe Dual Chamber Linear Positive Displacement Pump is now available in the Encore Dual Lane Encapsulation System. The precision pump is said to provide control to better than 1 percent for high-viscosity fluid. The pump's independently operated dual-chamber design allows continuous dispensing. Positive displacement is achieved with closed-loop feedback and a lightly toleranced, hardened piston and sleeve combination. The feedback loop is closed using high-resolution linear encoders mounted on each piston. Built-in cartridge heaters with thermocouple feedback transfer heat to the pump sleeve. Parts can be removed for cleaning and reinstalled without any tools. A range of pistons, sleeves and valves are available to accommodate all types and volumes of fluids. MRSI, Chelmsford, Mass.
PCB Transport SystemThe SIPLACE Productivity Lift is a PCB transport system that reportedly allows manufacturers to arrange placement machines in a traditional in-line configuration while obtaining the benefits of parallel line manufacturing. It reduces the impact of secondary times on production. Siemens Energy & Automation Inc., Norcross, Ga.
SMD Component Placement SystemThe MP-200 is reported to provide a solution for inspecting and taping two-sided SMDs fed from plastic tubes. The system features a compact footprint, minimal tooling and quick changeover. It can achieve throughput rates of up to 5,000 pph for high-speed applications. The system is able to accept components ranging from MSOP-8 to TSSOP-64 with minimal pickup nest changeover. Its pneumatic part transfer system minimizes the need for part-specific nest tooling. Immediately prior to pickup, an overhead camera performs marking and pin one inspection of the part. After pickup, a second on-the-fly vision system inspects the part for two-sided coplanarity. A third vision system inspects for tape pocket integrity, part orientation and 2-D lead inspection. It rejects to tubes via two independently programmable stations. Ismeca U.S.A., Vista, Calif.
Semiautomatic Solder Paste InspectionThe AutoLSM is a 3-D solder paste inspection system with automatic height measurement. With one click on the AutoMeasure icon, image-analysis software locates the laser stripe and reports paste height. The system is used off-line for checking wet solder paste on freshly printed PCBs to confirm printing quality. Collected data includes paste height, length, width, area and volume. Unlike 2-D inspection or visual methods, the system reports 3-D measurements including paste volume. Besides inspecting wet solder paste, it can be used to check stencil apertures, evaluate mask and plating thickness, and examine glue dots. CyberOptics Corp., Minneapolis, Minn.
Labeling CellThe HiSAC labeling cell reportedly guards against labeling errors by immediately placing a bar-code label onto each PCB as it enters the assembly line. It also verifies that the label is readable both before and after its placement on the board's surface by using a bar code. As an additional option, the labeling cell can be equipped with a LightVision System instead of a laser scanner. 2-D bar codes such as PDF47 and Data Matrix can be used in addition to normal bar codes. Board placement can be corrected with the help of fiducial checking. Vision can be used for on-line character recognition (OCR) or on-line character verifying (OCF), enabling the PCB type to be checked based on image or text. PMJ automec USA Inc., Grand Prairie, Texas.
CSP PlacementThe CSPBlaster placement machine has 300 8 mm feeder inputs, a component range up to 44 mm (tape-and-reel), the capability to place microchips as small as 0201s and handles boards up to 18 x 24". It features a camera arrangement with a unique horizontal lighting system that illuminates the solder bumps, but not the background reportedly increasing the accuracy of the machine's vision recognition systems. This system also offers cut bump and missing bump detection, as well as the ability to detect the perimeter of the component or all solder bumps. Panasonic Factory Automation Co., Panasert Group, Franklin Park, Ill.
Solder Paste MeasurementThe LaserVision SP2D solder paste inspection system combines laser measurement with automatic data collection for real-time control of SMT stencil printing. To obtain automated measurements, the operator positions the PCB in the desired measurement location under the system's measurement sensor. The operator then depresses a footswitch, and the system calculates and displays solder paste height, width and average measurements. Volume can reportedly be automatically calculated and displayed by entering a fixed value for the pad length. ASC International, Minneapolis, Minn.
Illumination ModuleThe UniversaLight illumination module reportedly offers a solution to the problem of imaging ceramic, flex and other substrates. The module includes a polarizing kit that is said to provide high-contrast images of light-colored ceramic substrates. Its wavelength can be selected to provide optimum image contrast on flexible circuits. The module consists of a support structure that holds eight LED petals and an inner LED ring. Each petal is a small PCB containing 10 LEDs of various wavelengths. The petals and inner ring can reportedly be exchanged in a plug-and-play fashion. Universal Instruments Corp., Binghamton, N.Y.
Programming and LabelingThe PP 100 is an automated programming, handling and labeling system for μBGA, QFP, TSOP, SOIC, PLCC, DIP and other packages. It is reportedly configurable with four to 16 programming sites; has high throughput (up to 850 devices per hour); and supports memory, microcontroller and logic in all device technologies and package types. Each programming site is said to provide 84 universal pin drivers as standard, with unlimited pin driver expansion. Input and output feeder options include tray (JEDEC, Motorola or NEC), tube or tape-and-reel. After programming or testing, devices can be marked with a laser (CO2 or YAG). Data I/O, Redmond, Wash.
Paperless Stencil CleanerThe Vortex on-board, paperless under-screen cleaner is said to eliminate the need for conventional paper rolls. It allows approximately 200 cleaning cycles to be completed before changeover. The cleaner replaces the paper roll and its mechanical delivery system with a reticulated foam cleaner, a snap-change cassette and a paper/charcoal activated filter that reportedly traps solder paste particles drawn off by vacuum. The foam is divided into three sections that provide all three cleaning functions (wet, vacuum-assisted and dry) in a single pass across the bottom of the stencil. DEK Inc., Flemington, N.J.
Rework SystemThe SNIPER is designed to accurately and consistently align and place CSPs, μBGAs, CBGAs and other SMT components in rework, prototype and low-volume build applications. It is said to integrate quick target acquisition; automatic pneumatic component placement; and high-power, low-temperature component removal and replacement in one machine. A split image of the component and PCB component pattern is viewed on a 21" monitor that is supplied with the system, and all axes are adjustable within a vacuum-locked PCB work table. In addition, all necessary temperature profiles are said to be stored within the machine. A.P.E. Inc., Key Largo, Fla.
Fine-pitch PlacerA computer-controlled guidance system, Preciplacer includes a CCD camera vision system that reportedly permits mounting of devices such as 208 QFPs with 0.020" pitch. With optional parallax-free 20X dual-image viewing of two corners of each component, manual assembly of fine-pitch devices down to 0.013" is said to be possible. The system's patented pickup head and arm automatically lock above each placement site, reportedly preventing placement errors. Manncorp, Huntingdon Valley, Pa.
Benchtop Dispensing SystemThe PC-controlled Champion 3000 is a benchtop dispensing system that comes prepackaged with the company's PowerPath dispensing software. It can be outfitted with a range of available valves and pumps, including the company's TrueVolume positive-displacement pump. The unit can be installed on an existing workbench or on its own work table. Options include vision with automatic fiducial adjustment, skew and stretch correction, and dot verification. Contact or non-contact height sensors and an automatic tip calibrator are also available. Creative Automation Co., Sun Valley, Calif.
Bulk-fed Pins and SocketsThe SMarT Feed mounts on SMT placement systems to position bulk-fed interconnect parts. The feeder is designed to separate, feed and present loose, surface mountable parts to the vacuum pickup head of virtually any placement machine. Its vibratory bowl can reportedly be placed anywhere close to the pick-and-place system. Parts are fed through a tube to the feeder head, which can be positioned in a regular slot and quickly changed. Other features include self-sensing feed replacement and automatic rejection of out-of-spec parts. Cambridge Automatic, Natick, Mass.
Temperature-resistant LabelsThe HeatShield series of temperature-resistant, printable polyester label materials is designed for high-temperature processing environments, up to 232°C for a duration of 30 minutes. It is suited for manufacturing and tracking applications where standard polyesters fail, such as labeling the topside of a PCB. The labels can be printed with any stand-alone thermal-transfer printer for hand apply, or used in conjunction with printer applicators to automate the process. Imtec Inc., Bellow Falls, Vt.
PC-based Machine Vision SystemVisionscape is said to be a complete machine vision system on a single PCI board for the Pentium/Windows PC. The product features an on-board CPU running a real-time operating system, on-board vision acceleration hardware and built-in multiprotocol network connectivity. In addition to accommodating OCV, bar-code and Data Matrix reading, it is said to support up to four analog cameras, advanced digital cameras, on-board SVGA display, digital and analog I/O, built-in serial communications and network support, and a Windows NT or 95 GUI. The system also provides a machine vision applications-development environment with Visual Basic access to underlying ActiveX controls. Robotic Vision Systems Inc., Acuity CiMatrix Div., Canton, Mass.
High-volume SMD PlacementWith speeds of up to 96,000 cph and a footprint of 50 sq. ft., the FCM Fast Component Mounter is said to offer high-SMD placement output per sq. ft., equal to three turret machines in actual production conditions. The slow movements of up to 16 independent placement modules, along with stationary feeders and boards, allow the machine to achieve a reported defect rate of less than 25 ppm, placing components down to 0402. Vision modules allow placement of components down to 0.020" pitch. Philips Electronic Manufacturing Technology, Alpharetta, Ga.
Conveyorized Work StationDesigned for all functions along the PCB assembly line, the Model 8300 work station has speed control, hand crank and an adjustable tool board. Other features include extruded aluminum framing, padded armrests, scalloped work surfaces, adjustable footrests and overhead lighting, as well as other optional accessories. Crown Simplimatic, Lynchburg, Va.
X-ray Inspection SystemThe Model RTX-Mini real-time X-ray inspection system is now available in an in-line configuration for use in conveyorized production lines. With a footprint of 16 x 5", the system incorporates high-sensitivity X-ray camera technology that can reportedly reveal defects as small as 0.001". Both portable and in-line versions can be upgraded with image processors, video micrometers and printers. Glenbrook Technologies Inc., Morris Plains, N.J.
Adjustable ShelvingAdjustable Super Erecta shelving reportedly allows the user to lift the lever on each corner and adjust the shelf at precise 1" increments. Units can be quickly changed to address changing electronics production storage requirements. The shelves are designed for quick and hassle-free adjustment. Stationary or mobile, the shelving is said to be designed for use with numerous space-saving accessories, including ledges, dividers and totes. InterMetro Industries Corp., Wilkes-Barre, Pa.
Chip Resistor ArrayApproximately the size of a 1206 chip resistor, the Series 746 package houses eight bussed resistors. The resistors have a tolerance of ±5 percent and are available in standard resistance values ranging from 33 Ω to 100 kΩ. The series is said to be designed for products demanding small size components such as portable computers, cellular phones and pagers. With more resistors in less space, the package reportedly allows system designers to reduce board size or free up space for other components. CTS Resistor Products, Berne, Ind.
Pin HeadersThe surface mount pin header assembly consists of square posts press-fit into round plated through-holes on a "header PCB." A circular solder pad on top of the board and square solder pad on the bottom are connected to the conductive plate of the through-hole. The size of the hole is such that it holds the square pin in place, yet leaves four cavities defined by the flat side of the pin and the curved wall of the hole. The cavities promote capillary action by drawing up most of the melted solder through the cavities where it forms a ring at the top. This action pulls the header board assembly into proper position, even if it is placed off-center on the PCB. The solder ring formed at the topside of the header assembly board is a visual indication that the reflow process is complete. Zierick Manufacturing Corp., Mt. Kisco, N.Y.
Non-polarized Signal RelayMeasuring 7.4 x 15 x 10 mm, the non-polarized 2 Form C HX surface mount signal relay is designed to withstand surge voltages of 1,500 V. Contact reliability is maximized by the device's gold-clad bifurcated structure for the moveable contacts and low gas materials for the forming material and coil winding. Rated at nominal switching capacity (resistive load) of 1 A/30 VDC or 0.3 A/125 VAC, the relay is engineered for an electrical life expectancy of 105 operations and a mechanical life expectancy of 107. Nominal operating power is 320 mW. Aromat, New Providence, N.J.
Photo-etched Chip InductorDesigned to be used for GaAs FET matching circuits, the PTL 1608 single-layer photo-etched chip inductor is said to feature 3 percent inductance tolerance over the full temperature range and a 100 ppm temperature coefficient. Self-resonant frequency is said to be controlled within 10 percent. Inductance is specified at 800 as well as 100 MHz. Available on tape-and-reel, the inductor is offered in 1 to 27 nH inductance values. Toko America Inc., Mount Prospect, Ill.
Miniature SMT DC-DC ConvertersThe NTE series of miniature, IC-style SMD DC-DC converters are reportedly capable of full-load, heat sink-free operation from -40° to 85°C. The converters are said to be suitable for reflow soldering at temperatures up to 280°C and have footprints of 1.64 cm2. Available as standard with 5 or 12 V inputs, the devices offer output options of 5, 9, 12 and 15 V. All of the models in the series have an input-to-output isolation of 1 kVDC and are housed in a UL 94V-0-rated plastic package. Designed for high-volume applications that require efficient PCB utilization, the converters incorporate multilayer ceramic capacitors for optimum reliability and toroidal magnetics for minimum noise emission. Newport Components Inc., Raleigh, N.C.
Thin-film FusesThe Accu-Guard Series of thin-film fuses have current values from 150 mA to 5 A in sizes including 0603, 0805, 1206 and 0612. Featuring accurate current ratings and fast response time, the fuses are reportedly ideal for telecommunications applications, battery chargers and packs, hard-disk drives, LCD screens and digital video camera equipment. The fuses are sold on tape-and-reel packaging and are compatible with high-speed automated assembly equipment. AVX Corp., Myrtle Beach, S.C.
Resettable FuseThe polymer-based PFMC Series PTC fuse is engineered to trip in 20 ms maximum at 8 A and 23°C. Measuring 3.0 x 2.35 mm, it is available in 0.2 to 1.1 A ratings, with interrupt ratings of 40 A and 6 to 15 V. The C-shaped, castalated terminal is said to enhance inspection of solder connections. The tape-and-reel packaged components suit PC motherboard, peripheral, mobile phone, and test and measurement equipment applications. Schurter Inc., Petaluma, Calif.
Feed-through EMI FiltersThe SBSM series of surface mount multilayer ceramic feed-through EMI filters provide electromagnetic filtering over a broad range of frequencies. The series is rated from 50 to 500 VDC, with high-performance devices reportedly providing more than 40 db insertion loss at 1 MHz at 10 ADC. Attenuation or insertion loss for these EMI chip filters begins at 100 kHz and is said to continue up in frequency through several gigahertz. The 20 ADC rated feed-through SMT EMI filters provide slightly lower performance at 1 MHz with insertion loss of 35 db. Synergistic Technology Group Inc., Tucson, Ariz.
One-piece Stacking ConnectorThe SEI Series 1 mm (0.039") pitch connector features a low profile of 1.65 mm (0.065") for board stacking applications. Phosphor bronze contacts are said to provide high normal forces with contact deflection of 0.020" (0.51 mm) when the boards are mated. This interface is surface mount soldered to one board and fastened to the mating board with standard SAE or metric screws. The connector is available with up to 50 contacts, as well as optional alignment pins. Samtec Inc., New Albany, Ind.
CMOS Image Sensor PackageThe Opto-CSP is a CSP designed for ICs incorporating CMOS image sensors. The transparent, ultra-thin, die-sized package integrates the light sensing, signal conditioning, memory and other components used in a CMOS imaging device on the same substrate during fabrication. In addition, the package is said to feature configurable spectral transparency and the ability to attach a range of spectral filters to the transparent surface. This process of integrating optics at the wafer level is said to reduce the total number of components. ShellCase Ltd., Jerusalem, Israel.
Common Mode InductorsOffering suppression of conductive EMI emission that meets FCC, EU EMI Directive and other agency requirements, the PM3700 series surface mount common mode inductors can be used for switching power supplies, battery chargers and other electronics devices. Encapsulation in a compact, high-strength LCP cup measuring 0.70" in diameter and 0.45" in height reportedly provides both mechanical and environmental protection for the coil. Effective attenuation range is 10 kHz to 100 MHz, current range is 1.0 to 7.0 A, and induction range is 0.2 to 20 mH. J.W. Miller, Gardena, Calif.
Clock Termination/Filter CircuitIntended to replace 16 discrete components, the PAC TF Series circuit reportedly provides both termination and filtering of clock lines in one miniature 24-pin QSOP package. Geared toward the PC market, the device is said to reduce the incidence of reflections, which can cause ringing, delays, crosstalk and other problems in high-speed microprocessor transmission lines. The circuit is also said to minimize high-frequency content of the signal above the necessary harmonics. California Micro Devices Corp., Milpitas, Calif.
Power JackThe KLD-SMT-0201L Mini DC Power Jack is designed for portable electronic applications. It features a gull-wing contact design, tape-and-reel packaging, built-in DC on/off switch and screw machine contact center pin for high-current capability. It is available in 1.0 and 1.3 mm pin diameters, has a current rating of 2.5 A and a voltage rating of 24 VDC. Kycon Inc., San Jose, Calif.
Bi-color Right-angle LEDThe Model 1211F Series is a bi-color right-angle surface mount component. It measures 3.0 x 2.0 x 1.0 mm. The component has a 120° viewing angle and comes in two color combinations. The BRPY1211F has one red die and one yellow die with a peak wavelength of 660/570 TYP/nm and luminous intensity of 17.6/8.8 lv/TYP/mcd/IF = 20 mA. The AYPG1211F has one yellow and one green die with a peak wavelength of 580/56 TYP/nm and luminous intensity of 3.0/5.2 lv/TYP/mcd/IF = 20 mA. Custom color combinations are available. Stanley Electric, Irvine, Calif.
Plastic OscillatorsThe EC1700 and EC1800 series of plastic surface mount oscillators have a frequency range of 70 to 125 MHz for high-frequency applications, and a footprint that measures 10.2 x 13.2 x 6.7 mm. Series options include ±25, ±50 or ±100 ppm stability, 0° to 70°C or -40° to 85°C operating temperature range and tight duty cycle. Tape-and-reel packaging is available in 1,000 piece increments. Ecliptek Corp., Costa Mesa, Calif.
DC/DC ConvertersIntended for use in telecommunications applications, the SM Series of surface mountable DC/DC converters features single-, dual- and triple-output configurations in 10 and 20 W versions. A low-profile (0.4" high) package facilitates tight card pitch requirements, while a 1.830 sq. in. design ensures compatibility with existing pick-and-place equipment. Other features include a 10 ms startup for hot-plug conditions, remote on/off for complex system timing requirements, and 24 or 48 V nominal inputs for wireless and central office telecom applications. Lambda Electronics Inc., Melville, N.Y.
Stacked CSPVertically mounting flash memory and SRAM onto a single package, this stacked, 8 x 10 mm CSP is designed for cellular phone, pager and other hand-held communications device applications. Manufactured using 0.25 μm flash process technology, the device is based on a standard I-pinout for flash densities up to 128 Mb. Outrigger bumps reportedly provide improved stability during board soldering, using as many as 72 bumps to connect the CSP to the PCB, with 0.8 mm pitch between bumps. Combinations offered include 16 Mb flash density/2 Mb SRAM and 32 Mb flash density/4 Mb SRAM. Flash Data Integrator (FDI) software, which integrates the functions of EEPROM, is also offered. Intel Corp., Santa Clara, Calif.
Board-stacking ConnectorThis low-profile, one-piece board-stacking connector features a 1.5 mm profile, reportedly making it ideal for mobile communications equipment. The contact design is said to provide a secure connection even if boards are not parallel. The connectors feature a dual row of contacts on 1 mm pitch and are available from four to 40 positions. Elco Corp., Myrtle Beach, S.C.
Shielded Power InductorsThe SHS Series of surface mount power inductors reportedly offers 100 percent ferrite shielding for high-density applications that must withstand current to 10,000 mA. The series is made up of coils in three size groups 0706, 1206 and 1208. Inductance levels in the 0706 Series range from 0.1 to 100 μH, with corresponding DCR maximums ranging from 0.004 to 0.140 Ωand DC current maximums from 5,000 to 800 mA. The 1206 types range from 10 to 680 μH, with 0.025 to 1.20 Ω DCR, 4,000 to 500 mA, and the 1208 versions range from 1.0 to 47.0 μH, with 0.007 to 0.10 Ω DCR, 10,000 to 2,500 mA. Associated Components Technology Inc. (ACT), Garden Grove, Calif.
1210 FusesThe PolySwitch microSMD product family includes six resettable fuses ranging from 0.05 A at 30 V to 1 A at 6 V. It is said to be designed for overcurrent protection in computer, consumer electronics and industrial process control applications. The products in the group are the microSMD005, microSMD010, microSMD035, microSMD050, microSMD075 and microSMD100 devices. The devices were designed to the industry-standard 1210 (3.2 x 2.5 mm) footprint. Raychem Corp., Menlo Park, Calif.
Crystal Clock OscillatorsThe SMD ST410H Series crystal-controlled, low-current oscillator line is available in 3.3 and 5 V versions. Providing precise rise and fall times required for driving TTL or HCMOS/ACMOS loads, the oscillators' high-frequency range from 32 to 125 MHz reportedly make them especially suited for fiber channel and gigabit Ethernet applications. The parts have short-circuit-protected ACMOS/HCMOS output and include tri-state control as a standard feature. Available in standard plastic SMD packages that conform to the EIA SO-J-20 footprints; the parts come on tape-and-reel. SaRonix, Menlo Park, Calif.
EMI ShieldA two-part, EMI shield, the BOLDT SHIELD II is packaged in standard EIA410 tape-and-reel formats for automatic board-level installation. Its removable lid design is said to provide easy access to inspect or repair important electronic components without having to detach the SMT shield. It is available in many JEDEC sizes, including 52-pin QFP, 256-position BGA and 84-pin PLCC. Boldt Metronics International, Palatine, Ill.
BGA Socket AdapterThe BGA Socketing System for upgrading, replacing, repairing, testing and emulating BGA devices is now available with a pin-to-pin pitch of 1.0 mm (0.039"). Intended as an alternative to soldering BGA devices directly to the motherboard, this system enables the BGA device to be soldered to an adapter, converting it to a pinned device that can be mated to a socket soldered to the PCB. Offering the same footprint as the device, the system is said to provide coplanarity of less than 0.006" (0.152 mm). Also, its eutectic solder bumps reflow at standard solder process temperatures. Tape-and-reel packaging is available. Advanced Interconnections Corp., West Warwick, R.I.
Peelable Coating MaskTempSeal TS-300 is a nonflammable, high-temperature, water-based liquid used for the temporary masking of PCAs during conformal coating. It covers and protects parts, through-holes, contact points and connections where coating is not desired. The mask can remain on the board until the beginning of testing. It contains no ammonia and reportedly will not inhibit the cure of silicone thermal conformal coatings. It is tack-free in 30 minutes, and curing time is approximately one hour at room temperature or 20 to 30 minutes in a 150° to 180°F oven. Once cured, its color changes from pink to translucent red. HumiSeal, Woodside, N.Y.
Water-soluble, Fast-printing Solder CreamsOASys water-soluble solder cream is a nonsurfactant-based cream that reportedly offers better intrinsic fluxing properties than surfactant-based creams, without high levels of halides and halogens. It is said to allow open time, tack time and abandon time of more than 16 hours each. The cream's print speed range is 15 to 200 mm per second. In addition, the company's latest Fastprint solder creams reportedly support fine-pitch, high-speed printing at up to 200 mm per second. These creams have a balanced activator flux system that is said to combine good solderability with no-clean properties, and allow low viscosity at high shear rates. Multicore Solders Inc., Richardson, Texas.
High-thermal AdhesivesThis Ag-filled organic system has been developed with thermal properties that reportedly exceed those of most common solders used to attach high-power devices. The DM4030, DM5030 and DM6030 series range in polymer chemistry from thermoplastic to thermoset, with interpenetrating networks (IPN) of both polymers, offering application-specific solutions to a variety of thermal management problems. The use of IPNs allows the properties of the processed film to be tailored for specific applications, such as high-temperature adhesion, without causing excessive stress on the components, reworkability in MCM, attaching large-area mismatched components, COB, high-power semiconductors and high-thermal interfaces. Pb metal is said to be eliminated as well as the plating requirements, voiding, stress concentrations, high-processing temperature, flux residue cleaning and nonoxidizing atmospheres associated with the use of solder. Diemat Inc., Topsfield, Mass.
Conformal Coatings LineFour different conformal coating formulations for specific production and rework applications are available. These coatings include silicone-based, acrylic-based, urethane-based and high-temperature formulations. Each protects PCBs, thick-film circuits and electrical components. They also contain Opti/Scan to allow for black light inspections. The coatings are available in 12 oz aerosol spray and 1 pint, 1 gal and 5 gal containers. Tech Spray, Amarillo, Texas.
Gold Clad WireThis gold clad wire features 10 to 24 K gold over copper and copper alloy, nickel-based alloys or other cores such as titanium and niobium in thicknesses of 25 μin up to the entire cross-section. Capable of being produced thinner than filled and thicker than plated wire, this wire is metallurgically bonded, which is said to make it more ductile and formable. Suitable for applications that require high conductivity with superior contact and corrosion resisitance, it is available in sizes from 0.005 to 0.125" OD. Anomet Products Inc., Shrewsbury, Mass.
Process Friendly PastesFormulated as a robust no-clean solder paste, R253 can be processed in air or nitrogen environments, is said to leave minimal residues and is compatible with ICT equipment. R598 is an organic, water-soluble paste designed to maintain its tackiness and printing characteristics for up to 10 hours. The activator package in R598 is aggressive, providing wetting to OSP-coated boards and silver/palladium leaded components. Kester Solder, a division of Litton Systems Inc., Des Plaines, Ill.
Bar SolderTRI-PURE HG bar solder is formulated with pure tin and lead to minimize dross. Solder is given a low dross proprietary treatment that results in a reported 10 to 15 percent reduction of generated oxides. The bar solder is said to ensure the integrity and aesthetics of solder joints, while providing efficiency in the soldering process. It exceeds QQS-571-F, J-STD-006 and ASTM BS32-96A specifications, and is suited for use in soldering surface mount components to PCBs. Solder is available in extruded and cast form in tin/lead or environmentally safe lead-free alloys including 99.3Sn/0.07Cu and 96.5Sn/3.5Ag. Bow Electronic Solders Inc., Sayreville, N.J.
Adhesive FilmsABLEFILM supported and unsupported adhesive films provide electrical conductivity, electrical insulation and thermal conductivity for a variety of bonding applications. The die-cut adhesive preforms eliminate paste application in a three-step process: the adhesive film is placed between surfaces to be bonded; components are assembled; and the adhesive cures at the recommended schedule. The 550-series adhesives are designed to adhere to gold-plated surfaces and other difficult-to-bond metals. The 561-series adhesive films are flexible epoxy products that are reportedly capable of bonding materials with severely mismatched CTEs. The 5025E film provides thermal conductivity, with electrical conductivity in the X, Y and Z axes. Ablestik Laboratories, Rancho Dominguez, Calif.
Surface Mount AdhesiveMA-420 is a snap-cure epoxy adhesive engineered to maintain high green strength to secure components during placement and wave soldering. This material is reportedly capable of ultra-high-speed dot dispensing or stencil printing without stringing, slumping or tailing. It snap cures in 60 to 90 seconds at 150°C or 180 seconds at 120°C. Packaging options fit all standard dispensing systems, and it is available in cartridges and DEK ProFlow cassettes for printing applications. Thermoset, Lord Chemical Products, Indianapolis, Ind.
UV-curable EncapsulantDesigned for IC encapsulation, UVE-1017-2 is sensitive to 365 nm broadband radiation, otherwise known as the UV-A spectrum. Because this is the longer UV spectra, cure depths of 0.60 to 1" are reportedly achieved. The encapsulant is suited for glob-top encapsulation. Its typical viscosity is 50,000 cps at 68°C. Average particle size of the filler is between 10 to 20 μm, with a maximum particle size of 50 μm, allowing the encapsulant to flow between narrowly spaced wire bonds. Zymet Inc., East Hanover, N.J.
VOC Resist StripperADF-35 is a low VOC resist stripper for inner layers that is exempt from SCAQMD regulations. It is reportedly suitable for removing fully aqueous dry films and screen-ink resists in spray applications. The stripper is said to produce large particles for easy filtration and less dissolved resist for a longer bath life. It contains anti-tarnish for an even copper finish. RBP Chemical Corp., Milwaukee, Wis.
Water-soluble Solder PastesESP 477 water-soluble solder pastes can reportedly be used for up to 24 hours without drying, clogging or print quality degradation. Their robust formulation allows them to be "dropped into" existing processes. The pastes are said to exhibit excellent stability and print to 0.012" pitch for extended periods with minimal slump at elevated temperatures or in high-humidity environments. They also feature a high-temperature flux system that cleans well and prevents charring. Residue is said to be removed with room-temperature water. The pastes are available in a variety of alloys, including lead-free. EFD Inc., ESP Solder Paste Group, Lincoln, R.I.
Ceramic Adhesives KitsThe Cermabond 585-A, 585-B and 585-C kits include 4 oz each of up to 11 different high-temperature ceramic adhesives. These inorganic formulations can be used for bonding, coating and potting ceramics, metals, glass, graphites, textiles and composite materials used in design, process and maintenance applications up to 3,200°F. These adhesives are inert, dielectric materials that are water-based and do not outgas after a low-temperature cure at 200°F. Aremco Products Inc., Valley Cottage, N.Y.
Cleaning WipesThese cleaning towels, reported to be cleanroom class 1000, can be used for SMT screen and stencil cleanup. Made from 100 percent filament polyester fiber, they are said to clean with low particle generation, low soluble extractables and low electrostatic charge. Reported to be unlaundered, lint-free and not generally affected by solvents, the towels measure 9 x 9". Amtech, Branford, Conn.
No-clean Solder PasteThe Delta 691 no-clean solder paste is reported to have a tack time of more than 48 hours, 24-hour stencil life and print speeds up to 8" per second. Post-soldering residues are clear and pin testable. It has a nine-month shelf-life when refrigerated at 35° to 50°F. It can be used in air or nitrogen reflow. Qualitek International Inc., Addison, Ill.
Non-water-based SolventsThe company's three new non-water-based solvents, OS-10, OS-20 and OS-30, have been granted the Clean Air Solvent (CAS) Certificate after a review by the California South Coast Air Quality Management District. The materials are produced from volatile methylsiloxanes. To qualify for this status, the solvents had to meet the following criteria: 50 g/l or less of VOCs, no toxic constituents, no ozone-depleting compounds, no ingredients that contribute to global warming and low vapor pressure. Dow Corning Corp., Midland, Mich.
Permanent Aerosol CoatingThe #2500 Staticide is an aerosol-based, permanent electrostatic-dissipative clear coating that is said to eliminate static electricity. It combines acrylic polymers with a unique semiconductor technology to provide permanent static dissipation, reportedly even under zero-humidity conditions. The coating can be used on all non-porous insulated surfaces such as keyboards, computers, mice, oscilloscopes and workstations. It is packaged in an aerosol spray can, does not particulate or cause outgassing, and is exempt from VOC reporting as an ESD aerosol product. ACL Inc., Elk Grove Village, Ill.
Lead-free, No-clean Solder PasteF369Cu0.5-89M3 solder paste is designed to replace 63/37 or 62/36/2 lead-bearing solders. It reportedly has a no-clean flux developed specifically for use with lead-free alloys to minimize defects and improve wetting by 100 percent over existing systems. The solder paste is designed to work with existing equipment. It has an eight-hour tack and work life, and complies with Bellcore and J-STD-004 requirements for no-clean pastes. This paste consists of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications. It can be reflowed in air or nitrogen. Packaging options include ProFlow cartridges; 5, 10 and 30 cc syringes; 250, 500 and 1,000 g jars; as well as 3, 6 and 12 oz cartridges. Heraeus, West Conshohocken, Pa.
Single-component AdhesiveThe EPO-TEK E3084 is a single-component, solvent-free, silver-filled polymer that features a high glass transition temperature (Tg) and low-storage modulus. It is designed for high-temperature, low-stress applications, including those in the flip chip, automotive and military/aerospace industries. When cured for one hour in a 250°C environment, the adhesive is said to have a greater than 300°C Tg. In addition, the storage modulus is 201,000 psi at room temperature. Epoxy Technology, Billerica, Mass.
Optical AdhesiveThe flexible optical adhesive UVA3155 was developed for coupling optical parts with more than 1,000 psi bond strength and greater than 99 percent transmission. The flexibility of the adhesive reportedly allows bonding of large parts and parts with different CTE without inducing shear or tensile stresses. It has a refractive index of 1.54 and retains flexibility at -65°C. Depending on thickness, the adhesive can be cured with medium-UV intensity between 1 to 5 seconds and has more than 12 months of ambient storage stability. AI Technology Inc., Princeton Junction, N.J.
Electrically Conductive EpoxyLoctite 3882 is an electrically conductive epoxy adhesive for electronic interconnect applications. It is said to be designed to replace solder in high-flexibility applications where stress cracking is a problem, such as on flex and flex on glass. This single-component, silver-filled epoxy is room temperature or heat curable and can be dispensed via syringe or stencil/screen printed. Electrically and thermally conductive, it can develop bonds between materials including metals, ceramics, glass, laminates and molded plastics. Loctite Corp., Rocky Hill, Conn.
Lead-free PreformsInTEGRATED preforms are available in lead-free alloys, including tin/silver, tin/silver/copper and indium-contained alloys. The preforms are joined by an array of fine solder strands. The strands melt and flow to adjacent pads during reflow. They are used in the attachment of multiple-pad/components such as over-connector pins, PGAs, and non-array applications such as vacuum or cryogenic seals, and other mechanical assembly operations. A variety of shapes and sizes are available. Indium Corp., Utica, N.Y.
Thermal-transfer Printable LabelsThe XF 558 thermal-transfer printable modified polyimide label is said to be able to withstand PCB manufacturing process temperatures of up to 500°F. When printed with the proper thermal-transfer ribbon, it is said to have consistent print quality and chemical resistance. Polyonics Inc., Westmoreland, N.H.
Contract Manufacturing ServicesServices offered by EMSOURCE LLC include: prototype and preproduction assembly; automated through-hole services; complete functional test; shipment to distributors and customers; turnkey/materials management solutions; conformal coating, potting and encapsulation; BGA assembly; ultra-fine-pitch assembly; box build; automated ICT; design for manufacturability; and design for testability. EMSOURCE LLC, Anaheim, Calif.
Design, Manufacturing and TestManu-Tronics offers various contract manufacturing services, including: insertion mount technology, SMT, automatic component insertion, automatic component placement, progressive assembly, automated wave soldering, automated IR soldering, automated chemical defluxing system, automated aqueous cleaning system, conformal coating, in-circuit and functional testing, stress testing, material and quality control, economic volume purchasing, cost reduction planning, prototype production, test equipment design, analysis and repair, product packaging, and on-time delivery. Manu-Tronics Inc., Kenosha, Wis.
BGA ReworkThe "Quick-Turn" BGA rework and reballing service can reportedly rework, inspect and ship PCBs within 48 hours of receipt. The full range of service includes cleaning the site of a used BGA and reballing the component, bringing it back to its usable condition. The service can be applied to a variety of BGA packages, including plastic, ceramic and micro. It can also include various sizes, both standard and custom. NETCO Automation, Haverhill, Mass.
Packaging Development for Prototype EvaluationThis customer packaging development center lets companies evaluate BGA/CSP packaging options and take delivery of packaged ICs within five working days. By delivering prototypes within less than a week, customers can evaluate and debug their silicon with advanced packaging options. Several iterations of prototypes are reportedly available to achieve full silicon performance prior to scheduling production. The facility provides wire-bonded and flip chip BGA/CSP packages. ChipPAC Inc., Santa Clara, Calif.
Test ServicesThis company is a full-service provider of test hardware and software solutions for today's generation of high-speed, densely populated PCBs. The range of test services include: DFT consulting; manufacturing test strategies development; MDA programming and development; ITA design and manufacturing; functional test software development; functional test hardware design and manufacturing; build-to-print services/exact duplicate manufacturing; test handler development and integration; wireless interconnect solutions; long-term test program management and support; complete documentation and system maintenance packages; full global implementation and support; on-site training; and site-sustaining engineering. Dii Technologies Test, Anaheim, Calif.
Electronic Packaging ServicesThis CM's new San Jose, Calif., office will serve both new and existing customers in the electronic packaging sector located in the West Coast. Services include: lead scanning, lead straightening, IC reclamation from boards, component reclamation, surface mount taping, radial taping, axial tape-and-reel, IC programming, demarking, black topping, IC marking, solder dip and environmental IC recycling. Customers can also choose from a variety of shipping services, including custom labeling, bar coding, split shipment, drop shipment and international shipments. PAR Components, Scottsdale, Ariz.
Solder TestingThis company offers a free test-evaluation procedure performed on specific soldering applications. The customer supplies actual parts requiring soldering, tests are performed with a soldering robot, and a video cassette is prepared and presented to the customer at no charge. The soldering system reportedly allows various operations from point-to-point to line soldering. The system memory can store ten different programs and 30 work centers defining various soldering program parameters. A range of soldering iron tips are available for use, as well as an optional fume-extracting system. I&J Fisnar Inc., Fair Lawn, N.J.
One-stop ShopThis company has introduced a one-stop shop, product development and design services for the high-tech electronics industry. The program reportedly offers electronics manufacturing for PCB assembly, mechanical assembly, automated SMT and through-hole assembly, burn-in, box build and system integration, ICT, functional test and system-level test capabilities. The turnkey services are said to complement the company's total solutions model. Customers can receive board layout design engineering, prototype to high volume and DFM/DFT. Express Manufacturing Inc., Santa Ana, Calif.
SMT ServicesSMT capabilities are now available in addition to this CM's array of PCB assembly services and turnkey solutions. Small components from 0402 to fine-pitch and BGA, along with hybrid "mixed" technology components, can be assembled at high speeds. Semiautomatic component placement and wave soldering accent the company's through-hole assembly capability. Other areas of expertise include panel/chassis wiring, subassembly, system integration wiring and CNC machining. Contraves Inc., East Pittsburgh, Pa.
Object Location/SearchSmART Search (Smart Alignment and Registration Tool) makes use of artificial intelligence-based techniques to advance the capability of object location/search. Its geometric modeling reportedly adjusts to variations in the manufacturing process while maintaining 1/40th sub-pixel repeatability. In addition, the user is able to show the machine vision system the object to be found, and the software tool will calculate optimal run-time parameters to cope with object changes anticipated by the manufacturing process. Imaging Technology Inc., Bedford, Mass.
Prototype Layout DesignLayout Freeware is a freeware version of the Douglas CAD/CAM Professional Layout program for the Mac OS. The freeware program offers most of the features available in the professional program, but with fewer output capabilites. With the software, PCBs can be designed in a 32 x 32" working area with a database resolution of 0.001". For SMT applications, both component-side and solder-side SMT footprint libraries are included. The program can also be used to design sheet metal parts such as enclosures or front panels for PCBs. Douglas Electronics Inc., San Leandro, Calif.
CIM, CAM PackagesVersion 4.0 of both EZ-CIM (documentation management and work-in-progress tracking) and EZ-CAM (computer-aided manufacturing) have been released. All modules have been redesigned to be faster and easier to use. Microsoft standards have been implemented so each program works like any other Windows-compatible application. New features include: split-screen display to view both the top and bottom of a board at the same time; unlimited levels of redlining via user-definable screen settings for color and patterns; independent screen and printer settings for color display vs. black and white printing; hyper-linked schematic and assembly drawing to locate and view components, signals, shorts, etc.; selectable layer viewing; and a snap to measurement tool. The CAM software has an enhanced module for fast design and fabrication of test fixtures. Unisoft, Milford, Conn.
Importing CAD DataThe company's software products can import CAD data from 14 different CAD systems. Products that it may now read include: GC-CAM, software that verifies and edits original Gerber design data prior to PCB production and includes an array of manufacturing and verification features; GC-PLACE, creates and verifies automated assembly machine programs, completely off-line; and GC-ICT, enables contract manufacturers and test houses to analyze and produce probe locations from Gerber data. GraphiCode, Mountainlake Terrace, Wash.
Return on Manufacturing AssetsThe Manufacturing Profitability Index (MPI) software is reported to be a mechanism for companies to measure return on manufacturing assets (ROMA). The software offers data to calculate ROMA, manufacturing utilization and overall profitability. The formula is designed to measure an existing production line. MPI = Throughput Efficiency x Gross Margin percent x Revenue. Real World Technology, Mount Prospect, Ill.
Package Manufacturing SoftwareEPCostModel software is said to be a full-featured cost modeling tool specifically tailored to the electronic packaging industry. The tool is said to take a range of factors into consideration when determining manufacturing cost, including different manufacturing facilities, varying delivery rates, labor inflation, learning curves, rework, equipment and floor space requirements, and facility investments. Operation sequences can be altered and inspection steps added or deleted. The report produced ranks significant cost drivers that may help identify cost savings. Initial templates are provided for PCB, LTCC, MCM-D and thick-film substrate technologies as well as a chip and wire-assembly technology. Relative Metrics Inc., Austin, Texas.
Component Placement SoftwareFeaturing visible placement areas and graphical design manager views, InterPlace software is intended to provide interactive component placement during PCB design. Design data, including components, nets, partitions, rooms, net classes and class-to-class information, is provided in hierarchical format. Partitions help to define boundaries for assembling like components, such as analog vs. digital devices. Grouping of components can be accomplished by identifying component traits, such as height, placement side and package size. The software is Windows 95 and NT compatible. ACCEL Technologies Inc., San Diego, Calif.
Software for Solder InspectionThe new Remote Teaching System (RTS) reportedly enables users of this company's solder inspection system to program off-line, alleviating the need to shut down the system during programming. The system acquires images from the inspection system via an RS-232 port, Ethernet connection or magneto optical disk, then processes and interprets using the included Teaching Interface (TI) software. These images can then be used for training, with all necessary programming able to be done at a remote location. Omron Electronics Inc., Schaumburg, Ill.
Remote Online ServicesThe CR-Anywhere remote online services system is said to offer interactive product training, diagnosis, software upgrades and troubleshooting to vision system customers worldwide via the Internet. This online capability allows customers to interact with company specialists with their integrated products. It was designed to complement the company's conventional technical service offerings. CR Technology Inc., Laguna Niguel, Calif.
Storage and Transmission The VIA-S200 Windows-based software is designed for storing images and transmitting them over the Internet or LAN, measuring samples, annotating details, creating comparison templates, or recording a series of measurements for use in other applications to make reports, charts, spreadsheets and presentations. The software reportedly enables users to share images during discussion, consult with colleagues over long distances, document images and build an audit trail, and measure images used in industry and telemedicine. It is designed to grab an image using a frame grabber or a TWAIN-compatible device, such as a digital camera or scanner. The software can also operate without a frame grabber, camera or a scanner when images are created and displayed on screen with another application. Images can be transmitted with the measurement and marker overlays, text and voice information to another computer for review, inspection, examination or comparison. Boeckeler Instruments Inc., Tucson, Ariz.
X-ray Database and InterfaceThe E7216A database software and the E7217A component object model interface enable open access for the HP 5DX series of automated X-ray inspection systems. The database software reportedly allows manufacturers to construct quality process software solutions, ranging from a simple spreadsheet application providing various SPC views to more elaborate, enterprise-wide quality-control systems. The software packages its real-time 5DX results in a Microsoft Access database format. A published schema for the defect and measurement data, included with the software, allows access to the results. The interface provides programmatic access to the X-ray's defect measurement data. Hewlett Packard, Palo Alto, Calif.
Process Management for Wire BondingCBT 6000 software uses a Windows NT environment for operation, process monitoring and management of the wire-bonding process. The graphical user interface assists with programming, operation and calibration routines. A hierarchical tree-type structure and setup wizards direct the user through system and program setup. The software uses prefabricated Microsoft Excel templates for analysis and performance monitoring. For example, statistical output from wire tests can be accessed with a template to analyze wire axis velocities. Velocity and error parameters for all four axes are graphed so parameters can be studied and adjusted with precision to maximize speed and yields. Walk-through wizard procedures, explanations and diagrams guide users through calibration routines. The Wire Properties window provides the ability to edit wire and bond parameters: first bond, second bond, loop and tail. Adaptive tolerance height is set to allow adjustment to variations in part height. Palomar Technologies Inc., Vista, Calif.
Laser-cut StencilsBy using Etch Guard software with this new equipment, this company can produce laser-cut stencils with straight, clean side walls for enhanced paste release. The stencils are available with the home base feature for use with no-clean paste printing on chip components. This process produces stencils suited for PCBs containing 0.015" ultra-fine-pitch or area-array components. Applications include direct attachment of flip chip to rigid or flex boards, solder or conducive epoxy for CSPs, as well as via interconnects for electronic packages. For laser-cut stencil preparation, the company accepts electronically transmitted Gerber data by e-mail, ftp or modem. SYSCON-MicroScreen, South Bend, Ind.
Software ModuleThe Zip Slice software module automatically images the internal three dimensions of an IC package. The module commands a C-SAM acoustic microscope to produce a sequence of nondestructive acoustic slice images, each of which is a specified internal layer within the IC package. The software stacks the individual slices together and shows the IC package as a 3-D rectangular solid. The number of slices depends on the thickness of the IC. Typically, 15 to 50 slices are used. To see internal features of the IC nondestructively, the stack is software-sectioned along a selected plane. Sonoscan, Bensenville, Ill.