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An Image Library of SMT Defects Section 6: BGA PCB Defects, Metallic Contamination
June 28, 2010 |Estimated reading time: 1 minute
-- These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 6 includes images of solder splash, copper peaks, loose copper as well as other PCB defects that can cause problems at solder stencil printing.
These images of SMT defects and attributes provide resources for training, quality control specs and standards, and research. The complete Section 5 image library appears below. Other Sections, published and upcoming, are listed below the gallery. Descriptions, provided below each image, do not necessarily define causality or severity, but serve only as identification.
Figure 1. Solder splash. Could have a negative impact on stenciling and solder joint integrity.
Figure 2. Metal lump or peak. Could impact stenciling and later reliability. Figure 3. Copper peaks. Might affect stenciling or reliability. Figure 4. Solder splash. Will impact stencil printing. Might level out in reflow. Figure 5. Metallic lump. Possible stenciling and reliability impact. Figure 6. Unknown defect; possibly another type of solder splash. Figure 7. Partially captured metal fragment. Could cause bridging. Note brittle maskant overlap: will impact fillet geometry. Figure 8. Unknown, possibly metallic FOD. Figure 9. Unknown. Assume that this defect will compromise wetting and joint integrity. Figure 10. Loose copper particles. Can cause electrical mischief, if not captured by solder.
Section 1. BGA PCB Defects, Plating
Section 2. BGA PCB Defects, External Damage
Section 3: BGA PCB Defects, Via-in-pad
Section 4: BGA PCB Defects, Dimensions, Poke-thru
Section 5: BGA PCB Defects, Mask
(Upcoming)Section 7. BGA PCB Defects, Non-metallic Contamination, FOD Section 8. BGA PWB-related Assy DefectsSection 9. BGA Assy X-sectionsSection 10. BGAs Re-balled Section 11. SMT Assy DefectsSection 12. SMT Assys, T-cycled CracksSection 13. SMT PWB PadsSection 14. PWB Vias, X-sections
Do you have images of solder-joint or other interconnect features or defects that you would want to share? Send them to Holly Collins at SMT, editorial@iconnect007.com. You must obtain permission to publish the photos and may not show proprietary or company-specific information on the images. We are particularly interested in images of advanced SMT assembly technologies and failure analyses.