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Stencil Printing of Small Apertures
May 8, 2013 |Estimated reading time: Less than a minute
Many of the latest SMT assemblies for hand-held devices present a challenge to process and manufacturing engineers with the introduction of miniature components such as 0.3 mm CSP and uBGA devices, as well as 0201 and 01005 chip component devices. Printing these miniature devices along with more conventional SMT devices like 0.5 mm QFPs and 0603 and 0805 passives, in addition to RF shields is a challenge. Whereas a 4 mil (100 micron) or 5 mil (125 micron) thick stencil provides good paste transfer for the normal SMT devices, stencils with this thickness have very low area ratios for the miniature devices. For example, a 0.3 mm CSP with a 7.5 mil (190 micron) has a 0.47 area ratio for a 4 mil thick stencil.
This article originally appeared in the April 2013 issue of SMT Magazine.