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SMT Engineers Declare Technica Tech Day a Success
October 15, 2014 |Estimated reading time: 1 minute
In the field of electronics manufacturing, the demand for void-free soldering is increasing due to changes in technology and processes. Lead-free soldering has a tendency to produce more voids in solder joints than the tin-lead solder process. BGAs and micro-BGAs with smaller ball size and pitches are more susceptible to the negative effects of voiding. The reliability of power electronics depends on homogenous solder connections to ensure proper dissipation of heat from power devices. Newer technologies such as LED lighting and solar concentrators require low-void or void-free solder connections.
The company’s recent technical seminar, "Void-free Soldering," was attended by some of the top electronics companies in the Silicon Valley. The feedback was positive, with several expressing a high level of interest in learning more about this process.
Co-sponsored by Rehm Thermal Systems, with collaboration from Technica’s other partners, ASM-Siplace and Heraeus Assembly Materials, and participation from Asys Group/Ekra Printing Technologies, LaserJob Inc. and Viscom AG, a live demonstration of void-free soldering was part of the day’s agenda.
Technica USA opened up its West Coast Demo & Training Center at their San Jose, California, location last July in cooperation with ASM-Siplace, along with contributions from its other key partners Heraeus and Rehm. As the home of ASM-Siplace’s West Coast Demo and Training Center, every calendar quarter ASM conducts three consecutive weeks of training and continuing education for existing and new users of their placement equipment. Customers from all over the Western U.S. have attended these sessions to participate in this value-added benefit. The center has also been used to conduct other applications work at the request of OEM and SMT customers over the last year.Read the full article here.Editor's Note: This article originally appeared in the September 2014 issue of SMT Magazine.