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The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Board designs that include advanced BGAs, CSPs with 0.4 mm and 0.3 mm pitch, as well as simpler 01005 and 008006 components, raise the bar for positioning demands and volume delivery for solder paste deposits.
According to the iNEMI 2013 Roadmap, placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 μm by 2023. This level of placement accuracy for components must be accompanied by a related accuracy for the deposit of solder paste and related fluids.
Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The ejection of fluid from a jetting head has been studied extensively for low-viscosity fluids.
This research has naturally been driven by work related to inkjet printing. The jetting of more complex fluids is challenging and the amount of research is limited. An interesting theoretical study on jetting in general was carried out by Clasen.
The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.
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Editor's Note: This article originally appeared in the April issue of SMT Magazine.
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.