YINCAE to Exhibit at SEMICON West

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YINCAE Advanced Materials is thrilled to announce that we will be exhibiting at this year’s SEMICON West, North America’s premier Microelectronics event. SEMICON West 2015 will be held at the Moscone Center in San Francisco, CA on July 14th -16th.

YINCAE Advanced Materials is excited to be showcasing some of our leading industry products at SEMICON West. Precise solutions are required to meet the fast changing demands of the microelectronic industry, and YINCAE is confident that we have the products to do so. YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/ Board/ Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. YINCAE innovated the WORLD's FIRST Lead -Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more.

YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

Semicon West attracts the world’s leading innovation companies who are responsible for the technologies that enable the microelectronics that drive today’s most sophisticated consumer and commercial electronics products. It is a great opportunity to see the most innovative products and services available in the industry. SEMICON West will be highlighting some of the more critical issues we will be facing in the future of semiconductor manufacturing.

We invite you to visit our booth 6072 in the North Hall to learn more about the wide array of material solutions we offer. We look forward to the meeting of minds at this conference and hope that you will join us!

About YINCAE Advanced Materials

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.



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