Murata Combines Freescale i.MX 6 Technology and Broadcom Connectivity


Reading time ( words)

As a leader in the electronics market, Murata’s Broadcom-enabled wireless modules have been optimized to easily integrate with Freescale’s i.MX applications processors to enable smart, secure and connected solutions in the consumer, industrial and automotive segments. The company’s solutions simplify wireless development and certification by minimizing the amount of RF expertise needed to develop new products.  Further underscoring its industry leadership position, Murata today also announced that it has become a Proven Partner in the Freescale® Connect Partner Program. Freescale’s i.MX applications processors are multicore ARM®-based solutions developed for multimedia and display applications with scalability, advanced security, and leadership power-performance capabilities.  As such, these products surmount some of the most common design challenges to deliver connectivity solutions to emerging markets such as IoT.

“One of the key attributes is the speed in which customers must get new IoT products to market.  It is not just this turn around time that poses a difficulty, but many are enabling connectivity for the first time and do not have the core hardware and software expertise,” said Mehul Udani, General Manager of Connectivity Solutions Group, Murata Americas.  “We are excited about this partnership as it fills a void in the market for a solution that comes integrated with Broadcom’s most advanced WiFi and Bluetooth integrated with the i.MX processor.”

“Murata is a great addition to the Freescale® Connect Partner Program.  Murata’s strength in innovating high quality wireless modules is a very complementary enablement for the i.MX series of application processors, which are becoming pervasive in the industry.  Murata’s scalable connectivity solution and integration into Freescale’s proven BSP allows an enhanced customer experience that drastically reduces time to market,” stated Ron Martino, Vice President Applications Processors and Advanced Technology Adoption, Freescale.

 Product requirements for multi-market and IoT applications vary considerably depending on specific applications.  To meet the myriad of needs, Murata modules are also enabled with Broadcom’s latest Wi-Fi and Bluetooth Smart Ready combo ICs, including pre-integrated drivers and Bluetooth stacks.  Broadcom’s pre-integrated connectivity features coupled with Freescale’s platform enables native support to significantly reduce the customer’s development cycle. 

“We are excited to introduce our latest wireless innovations integrated in a turn-key reference platform via our collaboration with Murata.  Broadcom’s advanced WiFi and Bluetooth offerings are efficiently designed into Murata modules which are incorporated in Freescale’s i.MX platform, allowing customers to streamline their development process to deliver wirelessly connected products to a diverse and growing IoT market,” added Brian Bedrosian, Broadcom Senior Director of Product Marketing.

Murata and Broadcom’s Connectivity Modules are optimized for vertical markets by incorporating numerous features.  Wi-Fi customers have several options, including 11ac/abgn, 11abgn, and 11bgn and include combo products with advanced coexistence as with Bluetooth and Bluetooth Smart Ready stacks.  The Murata module portfolio includes SIPs that are pre-Certified modules enabling a wide array of applications worldwide. 

About Murata 

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com.

Share

Print


Suggested Items

The iNEMI 2019 Roadmap: Optoelectronics

06/09/2020 | Pete Starkey, I-Connect007
Continuing the series of webinars highlighting recently-published chapters of iNEMI’s 2019 Roadmap—the comprehensive guidebook to the future goals and needs of the electronics manufacturing industry—the installment on optoelectronics examined and discussed data transmission by optical technology. Pete Starkey provides an overview.

The Foundation of Industry 4.0

04/15/2020 | Oren Manor, Mentor, a Siemens business
When adopting IoT solutions, start with three main considerations. First, assess which parts of the production cycle can be automated and/or monitored most effectively with IoT devices connected to an analytics platform. IoT technology should be matched to the production cycle of your operation.

IPC APEX EXPO 2020 Attendees Speak: Camille Sybert

03/13/2020 | I-Connect007 Editorial Team
"There’s a need for flexible solutions, so people are trying to make the most of the equipment that they buy, and they want to have the equipment that’s able to be flexible in scale with what it is that they’re looking for," said Camille Sybert of Nordson Electronics Solutions. "We have customers asking about future capabilities that they might not be ready for right now, but they want to know that it’s something that can be easily integrated into their processes in the future, as they’re in a position to better be able to do so."



Copyright © 2020 I-Connect007. All rights reserved.