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Tin Whisker Self-Mitigation in Surface Mount Components Attached with Leaded Solder Alloys

10/06/2015 | By Thomas Hester and David Pinsky, Raytheon Company
This article provides the findings of a lengthy project of soldering electronic components with pure tin finishes with lead-containing solder for the attachment. The object of the project was to determine the conditions under which sufficient alloying of the pure tin finish by lead in the solder is achieved for the purpose of whisker suppression.

Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies

02/24/2015 | Mitch Holtzer, Alpha
Although tin whiskers are very small crystalline fibers, they have reportedly caused multiple NASA satellites to become inoperable, automotive accelerator pedals to become unusable and a nuclear reactor to malfunction. The risk, however, can be minimized by specifying material sets that are less likely to produce tin whiskers.
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