ZESTRON Academy to Host Collaborative Workshop in Brazil

Reading time ( words)

ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing industry, will host a free “Solder Metallurgy, Stencil Design and Process Optimization” workshop together with White Solder and Metalfoto. This collaborative one day workshop will be held in Manaus, AM, Brazil, on August 20th.

Learn about PTH soldering processes, stencil design best practices, SMT cleaning processes, and PCB failure mechanisms.

Marlon de Medonça, Product Engineer and Consultant, White Solder, will present “Trends in the Metallurgy of Lead-Free Solders for PTH Soldering Process” followed by “Stencil Design and New Technologies” presented by Ronald Lammers, Technical and Commercial Manager, Metalfoto. The workshop will conclude with Axel Vargas, Sales Engineer, ZESTRON Americas, presenting “Improvements in Yield and Reliability for SMT Processes via Cleaning” followed by a cocktail hour and reception.

The workshop will be held at the Comfort Hotel Manaus, Manaus, AM, Brazil, on Thursday, August 20th from 2:00 PM to 7:30 PM.  For more information on ZESTRON Academy’s webinars, workshops and other learning opportunities, please visit ZESTRON Academy.  Registration is required for this learning event.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.



Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Copyright © 2020 I-Connect007. All rights reserved.