SMTA Capital Chapter Expo and Tech Forum to be Held September 1


Reading time ( words)

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 1. Exhibitors can save $100 by taking advantage of the early registration promotion available through July 31. Contact Kaitlyn Gherity, SMTA Expo Manager, at 952-920-7682 or kaitlyn@smta.org to exhibit.

During this year's expo, the Capital Chapter will host technical presentations by Mycronic, Creative Electron, ZESTRON Americas, and Indium Corporation. Specific topics include "Industry Trends are Boosting Jet Printing," "LED, BGA and QFN Inspection," "pH Neutral Cleaning Agents - Market Expectation & Field Performance," and "Transition From Water-Soluble to No-Clean Solder Paste - Just How Easy is It?"

Registration includes a complimentary lunch on the show floor as well as the opportunity to win numerous door prizes. Registration opens at 9:00 AM and the first technical presentation will start at 9:20 AM.  Exhibits are open from 10:00 AM until 3:00 PM.

Please join us for this great networking and educational event. To register online, please click here.

About SMTA:  30 Years Developing Solutions in Electronics Assembly

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.