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The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 1, 2015 as a focused symposium at SMTA International in Rosemont, Illinois.
In the first session, the Universal Instruments Consortium will provide and update on their ongoing Lead-Free project. The second session includes presentations related to Corrosion and Flux Residue Impacts of Lead Free Solders. The third session of the symposium will address Tin Whisker Research and Mitigation. The fourth session will focus on recent advances in Lead-free Solder Joint Reliability.
Companies presenting research include Alcatel-Lucent, BAE Systems, Binghamton University, Celestica, Inc., Kester, National Physical Laboratory, Nihon Superior Co., Ltd., Universal Instruments Corporation, and University of Toronto, among others.
This event organized by Paul Vianco, Ph.D., Sandia National Laboratories, Matthew Kelly, P.Eng., MBA, IBM Corporation and Elizabeth Benedetto, Hewlett-Packard Company, is renowned for presenting the strongest Lead-free technical information in the electronics industry.
Details of the Lead-Free Soldering Technology Symposium can be found here.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.