Microtronic to Exhibit at the IMAPS EMPC in Germany


Reading time ( words)

Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to exhibit at the 20th European Microelectronics and Packaging Conference & Exhibition (EMPC), scheduled to take place Sept. 14-16, 2015 in Friedrichshafen, Germany. Company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and Sonix ECHO™ as well as specialty solders from AIM.

Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature profile.  A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

Microtronic2.JPGOf course, it also can measure using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.

 The Akrometrix TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample's behavior during a user-defined thermal profile.

Microtronic3.JPGThe Sonix ECHO™ Ultrasonic Flaw Detector is an industry-leading scanning acoustic microscope that provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.

About Microtronic

Microtronic was founded in 1981 and is based near Munich, Germany. With 30 years’ experience, we are the microelectronics leaders in Europe and offer a wide range of products and services to the microelectronics industries. We run regular training courses on various topics through in-house training or can arrange for specific employee training courses on request to suit your needs. 

Our customers include companies who require added solderability test, ultrasonic microscopes, circuit board repair systems, welding systems, solders and solder pastes. We offer centralised pricing to our customers with the added benefit of unparalleled delivery times from our centralized European warehouses.

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.



Copyright © 2020 I-Connect007. All rights reserved.