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Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Stencils are now being used for wafer bumping, wafer level ball placement, and mixed assembly of flip chip and SMT. The presentation will describe new methods of stencil printing, the types of stencils, configurations, and performance.
"Stencil design -- aperture size, stencil thickness, the stencil material, the smoothness of the apertures, spacing between apertures, and area ratio -- plays a major role in maximizing performance," explained Holmes. "The use of stencils is no longer confined to just the PCB industry or laser formed stencils. They now contribute significantly to the semiconductor assembly process and are made of new materials, in cleanrooms, and often using laser direct imaging."
For more information, contact Photo Stencil at firstname.lastname@example.org, call 719-599-4305, or check out the website at www.photostencil.com.
About Photo Stencil
Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB® electroform stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade® squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs and has a manufacturing facility in Mexico.