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The IPC APEX EXPO 2016 hosted by the Las Vegas Convention Center from March 15th – 17th is only two months away! Featuring world-class educational opportunities with leaders in industry practice and research, this year’s Forward Thinking for Tomorrow’s Technology theme will offer unparalleled opportunities to access solutions to industry experts. We look forward to helping you to meet your challenges and invite you to stop by our Booth 1718 to learn more about the innovative products and custom solutions that we offer.
On Thursday, March 17th, 2016 from 9:00AM – 10:00 AM, Dr. Yin, a global leader in adhesives research and manufacturing will be presenting his white paper, “Can Lower Temperature Solderable Adhesive Replace SAC Paste?” He will not only discuss the development of low temperature solderable adhesives to replace SAC applications, but the myriad of benefits for use across industry domains. The low temperature solderable adhesives can be used anywhere, particularly for wafer-level (CSP), package-level, and board-level (LGA, BGA, and QFN) to name a few. The reliability was equal or better than that of SAC alloy. The low temperature solderable adhesive has improved drop performance by two magnitudes compared to Sn/Bi alloy.
We at YINCAE Advanced Materials, LLC hope you will join us to learn about YINCAE and the exclusive products that you will not find with any other manufacturer in the world. We look forward to seeing you at booth 1718.