IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2015

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Steven Xu, Ph.D, general chair for IWLPC 2015, has announced the Best of Conference, Best Presentation & Best Papers in WLP, 3D, MEMS program tracks  as chosen by the technical committee from the respective technical tracks based on technical merit, relevance, originality, knowledge of subject, quality of material and quality of presentation.

Best of Conference Paper is awarded to Lutz Hofman  of Fraunhofer ENAS

“3D Wafer-Level Packaging by using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages”

Best of Conference Presentation is awarded to Chet Palesko of Savansys Solutions for the presentation entitled

“Technology and Cost Comparison of Electronic Packaging Methods”

Best of 3D track is awarded to Tom Strothmann of Kulicke & Soffa for his paper on

“Methods for Assembly of TSV Products”

Best of WLP track is awarded to Thomas Uhrmann  EV Group / Jose Campos NANIUM for their paper on

“Temporary Wafer Carrier Solutions for Thin FOWLP and eWLB-based PoP”

Best of MEMS track paper is awarded to Lutz Hofman  of Fraunhofer ENAS

 “3D Wafer-Level Packaging by using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages”


IWLPC brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMS device packaging technologies.

Addressing wafer-level packaging, 3D, and MEMS technologies, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of the packaging technology evolution. The conference has a rich history of bringing together attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends. Going into its 13th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals.

The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and MEMS development. Workshops, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 60+ exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATs, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies.

Go to IWLPC.com

About SMTA

A non-profit international association of companies and individuals (totaling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

The association is dedicated to the advancement of the electronics industry through member education and interaction. Local chapters are based in the United States Canada, Mexico, Brazil, India, Israel, Malaysia, Taiwan, and China.

Educational programs, symposia, and seminars are held throughout the year in various locations in the United States, Canada, Mexico, China and Malaysia. The SMTA produces SMTA International, a major annual conference and exhibition currently held in Rosemont, IL (September 25-29, 2016). Go to smta.org



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