IPC APEX EXPO: Kyzen, Dell Discuss Latest HDP User Group Research and Activities

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Kyzen CTO Mike Bixenman and Dell's PCBA Senior Technologist Wallace Ables discuss with I-Connect007 Guest Editor Dick Crowe the latest projects and activities of the High Density Packaging (HDP) Users Group, a non-profit trade organization involved in the supply chain of producing products that utilize high-density electronic packages.

In particular, they talked about a research project that aims to develop a test process and procedure to identify the risk of pitting and crevice corrosion from the no-clean fluxes on assembled products.

Watch The Interview Here



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