Team of Industry Experts to Present Cleaning/Materials/X-ray Workshop

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Circuit Technology, KIC, KYZEN, Nordson DAGE, Aqueous Technologies and AIM Solder are working together to present the “Reliability Workshop: Cleaning – Materials – X-ray” in Raleigh, NC on Tuesday, April 12 and Asheville, NC on Thursday, April 14. Both workshops will take place from 8 a.m.-4:30 p.m.

Over the past 20 years, the electronic manufacturing industry has seen cleaning (defluxing) become more necessary and more challenging. Never before has the removal of contamination from circuit assemblies been so important to a product’s overall reliability. Increasing component and assembly densities, decreasing standoff heights, higher reflow temperatures, and increased reliability expectations have created a “perfect storm” that is driving manufacturers to seek cleaning and other reliability-related solutions.

Experts from cleaning chemicals and equipment, soldering materials, thermal profiling, and X-ray will present valuable and technically relevant information in a one-day technical workshop. This free resource will answer many common questions about cleaning, cleanliness testing, profiling, failure analysis, inspection, and other reliability related topics. Seating is limited so reserve your seat today. A continental breakfast and lunch will be provided.

The agenda follows: registration and breakfast from 8-9 a.m., and welcome and introduction from 9-9:10 a.m. Michael Konrad of Aqueous Technologies will kick off the presentations with “A Candid Conversation about Cleaning” from 9:10-10:10 a.m. After a brief break, Konrad will present “How Clean Is Clean (Enough)?” from 10:20-10:50 a.m. Debbie Carboni of KYZEN will follow with the presentation “What My Son and Your Assembly Have in Common” from 11 a.m.-12 p.m. Lunch will then take place from 12-1 p.m. After lunch, MB Allen of KIC will present “Improve Productivity in a High-Mix Environment – Reflow Related” from 1-1:40 p.m. Timothy O’Neill of AIM Solder will follow with the presentation “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing” from 1:50-2:40 p.m. From 2:50-3:50 p.m. John Travis of Nordson DAGE will present “Defect Recognition and Failure Analysis with High-Resolution X-ray and 3D Computer Tomography”. After that final presentation, from 3:50-4:30 p.m., an individual process questions and solutions period will take place.

The April 12 event will take place at NC State, 930 Main Campus Dr., Suite 200, Raleigh, NC 27695. To register for this event, click here. The April 14 event will take place at the Asheville-Buncombe Technical Community College, 1459 Sand Hill Rd., Candler, NC 28715. To register for this event, click here.

For additional information about the workshop, contact Chad Cisneros at 951-298-8879, or click here.



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