IPC APEX EXPO: Mirtec's D'Amico Speaks on How 3D AOI Tackles SMT Inspection Challenges

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Brian D'Amico, president of Mirtec, speaks with I-Connect007 guest editor Bob Neves about the inspection challenges in the SMT industry amid the continuing trend towards smaller devices and components, and how 3D AOI is helping manufacturers address these issues.

He also talks about the different inspection requirements of the semiconductor market as compared to the SMT industry, and how he see the two industries converging in the future.

Watch The Interview Here


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