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Shenmao America Inc. will put into display its SMF-WB02 and SMF-WB51 Water Soluble Flux at the upcoming IEEE Electronic Components and Technology Conference 2016, which will be held from May 31–June 3 at The Cosmopolitan of Las Vegas in Las Vegas, Nevada.
Made in the United States, the SMF-WB02 and SMF-WB51 features low viscosity, high tackiness, consistent printability for BGA and Micro BGA ball assemblies, and excellent washability after high temperature reflow (255°C and 60s over 220°C). The SMF-WB02 and SMF-WB51 create highly reliable solder joints with optimum maximized quality.
Shenmao will be at Booth 505.
To register for the event, click here.