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Shenmao America Inc. will be showcasing its halogen free, water soluble PF606-P116 LED die bonding solder paste and PF606-XP low viscosity LED BGA and Micro BGA ball dipping solder paste at the IEEE Electronic Components and Technology Conference (ECTC), happening June 1–2 at The Cosmopolitan of Las Vegas in Las Vegas, Nevada.
The PF606-P116 LED die bonding solder paste is available for dispensing in syringes in medium viscosity; exhibits excellent slump characteristics, consistent dispense ability, stable tackiness force with great transfer rate, and is available in T3 to T8 powder size.
The PF606-XP, meanwhile, has great slump characteristics and stable tackiness force, exhibiting extremely uniform dipping volume for consistent high quality Joints.
Both products will be put on display at Shenmao's booth (Booth 505).