-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ACE to Host Solderability and Lead Tinning Workshop in Arizona on August 10
June 29, 2016 | ACE Production Technologies Inc.Estimated reading time: 2 minutes
ACE Production Technologies Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce that its ACE Component Services group, in conjunction with Phase 4 Inc., will host a solderability testing and component lead tinning workshop in Arizona.
The workshop will be held on Wednesday, August 10, 2016 at TechShop, 249 East Chicago Street in Chandler, Arizona. This technical workshop will include a classroom process training session followed by a Q&A session as well as one-on-one discussion after the workshop is concluded.
Who Should Attend
- Process Engineers
- Manufacturing Engineers
- Quality Personnel
- Procurement Personnel
What They Will Learn
- Understanding the new J-STD-001 Rev F requirements
- Differences between solderability testing and component re-tinning
- Dip and look and wetting balance solderability test methods
- Motivation behind the need to hot solder dip components
- How the new J-STD-001 Rev F impacts you and your company
Solderability is no longer an option for many high reliability segments of the world’s electronics assembly industry. With implementation of the new Rev F of J-STD-001, solderability testing, gold removal and component re-tinning have become prerequisites for doing business and remaining competitive in the global marketplace. This classroom session focuses on the technical aspects of solderability testing and the component re-tinning process. Topics Include:
- Tin whisker mitigation
- Gold embrittlement and removal of gold plating
- RoHS and tin-lead component supply chain trends
- Solderability testing protocols
- MIL-STD-883 and J-STD-002 standards
- SMT and through-hole component re-tinning
- Legacy component refurbishing and RoHS to tin-lead conversion
- ANSI/GEIA-STD-0006 component re-tinning requirements
- Coplanarity and solder thickness
This much anticipated workshop entitled "Solderability and Lead Tinning for the 21st Century" will describe the removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation as the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. The recommendation that the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with ANSI/GEIA-STD-0006 to enhance component solderability will be discussed extensively.
This highly informative workshop is offered at no cost to all attendees courtesy of ACE Production Technologies and Phase 4 Inc. and covers all aspects of the solderability testing and component re-tinning processes. For more information about this one of a kind solderability testing and component lead tinning workshop, or to register for the workshop, contact Tom Dunn at tdunn@phase4inc.com or call either 480-966-2018 or 602-524-6431.
About ACE
ACE Production Technologies Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com..
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.