ACE to Host Solderability and Lead Tinning Workshop in Arizona on August 10


Reading time ( words)

ACE Production Technologies Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce that its ACE Component Services group, in conjunction with Phase 4 Inc., will host a solderability testing and component lead tinning workshop in Arizona.

The workshop will be held on Wednesday, August 10, 2016 at TechShop, 249 East Chicago Street in Chandler, Arizona. This technical workshop will include a classroom process training session followed by a Q&A session as well as one-on-one discussion after the workshop is concluded.

Who Should Attend

  • Process Engineers
  • Manufacturing Engineers
  • Quality Personnel
  • Procurement Personnel

What They Will Learn

  • Understanding the new J-STD-001 Rev F requirements
  • Differences between solderability testing and component re-tinning
  • Dip and look and wetting balance solderability test methods
  • Motivation behind the need to hot solder dip components
  • How the new J-STD-001 Rev F impacts you and your company

Solderability is no longer an option for many high reliability segments of the world’s electronics assembly industry.  With implementation of the new Rev F of J-STD-001, solderability testing, gold removal and component re-tinning have become prerequisites for doing business and remaining competitive in the global marketplace.  This classroom session focuses on the technical aspects of solderability testing and the component re-tinning process.  Topics Include:

  • Tin whisker mitigation
  • Gold embrittlement and removal of gold plating
  • RoHS and tin-lead component supply chain trends
  • Solderability testing protocols
  • MIL-STD-883 and J-STD-002 standards
  • SMT and through-hole component re-tinning
  • Legacy component refurbishing and RoHS to tin-lead conversion
  • ANSI/GEIA-STD-0006 component re-tinning requirements
  • Coplanarity and solder thickness

This much anticipated workshop entitled "Solderability and Lead Tinning for the 21st Century" will describe the removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation as the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. The recommendation that the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with ANSI/GEIA-STD-0006 to enhance component solderability will be discussed extensively.

This highly informative workshop is offered at no cost to all attendees courtesy of ACE Production Technologies and Phase 4 Inc. and covers all aspects of the solderability testing and component re-tinning processes. For more information about this one of a kind solderability testing and component lead tinning workshop, or to register for the workshop, contact Tom Dunn at tdunn@phase4inc.com or call either 480-966-2018 or 602-524-6431.

About ACE

ACE Production Technologies Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly.  ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production.  ACE also provides solderability testing, lead tinning services and process development services.  For more information, click here, call 509-924-4898 or email sales@ace-protech.com..

Share

Print


Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.



Copyright © 2019 I-Connect007. All rights reserved.