SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 30


Reading time ( words)

The SMTA Capital Chapter will be holding its Capital Expo and Tech Forum at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland 20723, on August 30.

During this year's expo, the Capital Chapter will host technical presentations by re:3D, Kyzen Corporation, Nokia, and MET Stencil. Specific topics include "How 3D Printing Hardware and New Materials are Changing the Face of Manufacturing," "Video Analysis of Solder Paste Release From Stencils," "Implementation of a Collaborative Industrial Consortia Program to Characterize the Thermal Fatigue Reliability of 3rd Generation Pb-Free Solder Alloys," and "An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios."

Registration includes a complimentary lunch on the show floor as well as the opportunity to win numerous door prizes.  Registration opens at 8:00 AM and the first technical presentation will start at 9:00 AM.  Exhibits are open from 9:00 AM until 3:00 PM.

To register online to attend or exhibit, visit http://www.smta.org/expos/#capital.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.