SHENMAO to Showcase BGA Solder Spheres and Bumping Paste at SEMICON Taiwan


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SHENMAO Technology Inc. will exhibit its BGA solder spheres for PBGA, CBGA, TBGA, MBGA, CSP and flip chip assemblies at the upcoming SEMICON Taiwan trade show, which will be held from September 7–9, 2016 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

Made by UMT (ultra micron technology) from highly pure metals produced to various exact alloy compositions using piezoelectric droplet jet technology, the BGA solder spheres feature accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. They are also available in various diameters: 0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.Shenmao-23Aug16.jpg

SHENMAO will also put into display its high drop-resistance alloy PF902-S (SAC0307X), which greatly increases reliability and performance of portable electronic devices.

For more information, please contact SHENMAO Technology Inc. at +886-3-416-0177 or e-mail solder@shenmao.com.

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