-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
2D X-ray Inspection With Materials and Thickness Identification
June 7, 2017 | Paul D. Scott, Ph.D., IBEX Innovations, and Evstatin Krastev, Ph.D., P.E., Nordson DageEstimated reading time: 7 minutes
Figure 2: Materials curves (left) generated from training the system on the wedge samples (right).
MACHINE LEARNING/USER INTERFACE
Machine learning algorithms have been developed to enable decisions to be made on material type and thickness based on the materials space plots generated from the image obtained using the MAP. The algorithms require training using a set of training standards. Once the training stage is complete, the algorithm is able to identify the material and thickness of previously unseen samples. Under ideal test conditions, the algorithm has been shown to have a misclassification rate of less than 2% and is able to identify thickness to better than 1% of the true value.
Once the MAP has been fitted to the CMOS detector, the calibration, database training and sample analysis are handled by a simple user interface which is integrated into the X-ray inspection system software. An example is shown in Figure 3, where wedges of three materials are trained and used to identify the material types on the right of the image.
Figure 3: Screen shots showing a user interface which is designed to allow materials training (top) and identification (bottom).
The algorithm works at a rate compatible with image acquisition times and generates a standard grey-scale image as part of the process.
EXAMPLE APPLICATIONS
This article is focused on discussing the X-ray MAP inspection technology for the electronics industry, including PCBs and semiconductor applications. In this section, we show some examples of the MAP X-ray inspection technology applied in the security and food industries. The intention is to enhance the reader’s understanding of the technology and to facilitate the generation of ideas and requirements that can apply for the electronics industry.
Security Inspection
Security threats may be disguised within everyday objects such as laptops and mobile telephones, which are legitimately carried. X-ray security scanners typically use measurements taken at two voltage settings of the X-ray generator in order to generate materials information. This approach requires two scans. Using the MAP, the measurement can be reduced to a single scan at only one voltage setting.
A desk telephone, shown in Figure 4, was measured as an example of a complex object containing electronic circuitry and plastics. Data were collected at 120 kV, 0.5 mA, with a 0.5 s exposure, using a conventional, low-power tungsten X-ray source and a silicon flat-panel detector equipped with the MAP technology. Analysis of the image data leads to the materials discrimination image shown in Figure 4 (right). The color-scheme here is one typically used in security applications: plastics and other organic materials are presented in orange; so called poor metals, such as aluminum, are shown in green; denser metals are shown in blue.
Figure 4: (Left) Absorption contrast image of a telephone. (Right) Materials contrast image showing plastics (orange), poor metals (green) and dense metals (blue).
We see the potential for the same techniques to be applied in PCB inspection to highlight inconsistencies in circuit boards and other electronic components.
To read the full version of this article, which appeared in the June 2017 issue of SMT Magazine, click here.
Page 2 of 2Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.