October 2018 Issue of SMT007 Magazine Available Now


Reading time ( words)

The PCB assembly industry is edging closer to the true vision of Industry 4.0. With IPC’s Connected Factory Exchange (CFX) standard—a common machine communications standard for the electronics assembly supply chain—electronics manufacturing is on its way to become even smarter.

The October 2018 issue of SMT007 Magazine looks at the latest developments in the CFX standard and its overall impact on the PCB assembly process.

Read the October 2018 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.

Be sure to download the PDF version for future reference.

Share

Print


Suggested Items

Oren Manor on the Siemens-Mentor Integration

11/26/2019 | Real Time with...productronica
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.