2015’s Most Read SMT Articles


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Solder Paste Stencil Design for Optimal QFN Yield and Reliability

Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads is discussed.

A Review of the Opportunities and Processes for Printed Electronics

In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.

Advanced Printing for Microelectronic Packaging

The concept of dispensing a wide range of materials in three dimensions presents a potential change in electronic packaging. This article covers the concept of combining dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits.

Reliability Study of Bottom Terminated Components

This article series discusses bottom terminated components (BTC), and the stress and strain on these components when it comes to solder joints. In Part 1, the authors look at the impact of large voids at the thermal pads of BTC components and their impact on solder joint reliability.

How to Streamline PCB Thermal Design

Thermal issues with a PCB design are mostly determined during the component selection and layout phases. John Parry of Mentor Graphics discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.

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Recent Advances in X-ray Technology: SMTA Webinar Recap

08/12/2019 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.

Which Matters Most: Unit Cost or Total Cost of Supply?

08/09/2019 | Neil Sharp, JJS Manufacturing
The primary objective for any OEM is to design, manufacture, and deliver high-quality products in the most cost-effective way possible. When demand patterns change, or there is an increase in competition, it can be easy to rely on the calculation of unit cost to relieve the price pressure. But, as many manufacturers are discovering, choosing to base their outsourcing decisions purely on unit cost may not always reap the expected benefits in the long term.

The Exciting Details Behind IPC’s Pledge to America’s Workers

08/07/2019 | Chris Mitchell, IPC VP, Global Government Relations
In the nine months since IPC joined in President Trump’s “Pledge to America’s Workers” and committed to creating 1 million new skilled workforce opportunities over the next five years – a fair question has been asked: Are we taking credit for actions we would have done anyway? Was this motivated by politics?



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