2015’s Most Read SMT Articles


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Solder Paste Stencil Design for Optimal QFN Yield and Reliability

Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads is discussed.

A Review of the Opportunities and Processes for Printed Electronics

In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.

Advanced Printing for Microelectronic Packaging

The concept of dispensing a wide range of materials in three dimensions presents a potential change in electronic packaging. This article covers the concept of combining dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits.

Reliability Study of Bottom Terminated Components

This article series discusses bottom terminated components (BTC), and the stress and strain on these components when it comes to solder joints. In Part 1, the authors look at the impact of large voids at the thermal pads of BTC components and their impact on solder joint reliability.

How to Streamline PCB Thermal Design

Thermal issues with a PCB design are mostly determined during the component selection and layout phases. John Parry of Mentor Graphics discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.

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Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

04/14/2021 | Brent Fischthal, Koh Young America
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.



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