2015’s Most Read SMT Articles
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads is discussed.
A Review of the Opportunities and Processes for Printed Electronics
In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.
Advanced Printing for Microelectronic Packaging
The concept of dispensing a wide range of materials in three dimensions presents a potential change in electronic packaging. This article covers the concept of combining dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits.
Reliability Study of Bottom Terminated Components
This article series discusses bottom terminated components (BTC), and the stress and strain on these components when it comes to solder joints. In Part 1, the authors look at the impact of large voids at the thermal pads of BTC components and their impact on solder joint reliability.
How to Streamline PCB Thermal Design
Thermal issues with a PCB design are mostly determined during the component selection and layout phases. John Parry of Mentor Graphics discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.
Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This article outlines a series of passive thermal improvements that are easily integrated into legacy systems and can provide a 3-4x increase in dissipated power.
Benefits of Soldering with Vacuum Profiles
Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, bringing new challenges that are evolving on a daily basis due to the relentless introduction of new variants of so-called bottom-terminated components (BTCs).
NEPCON China Showcases Latest Manufacturing Tech in Asia
Considered Asia’s biggest, most influential SMT and electronics manufacturing event, NEPCON China 2015 attracted over 450 leading brands from 22 countries, who showcased the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm.
Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering is difficult to detect by monitoring electric resistance since it initiates before an electrical failure occurs. This article presents the results of pad cratering susceptibility of laminates using the acoustic emission method under four-point bend and compares the AE results to the pad-solder level testing results.
EMI-caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This article analyses sources of such noise, how it affects components and how to mitigate this problem.