2015’s Most Read SMT Articles


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Solder Paste Stencil Design for Optimal QFN Yield and Reliability

Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads is discussed.

A Review of the Opportunities and Processes for Printed Electronics

In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.

Advanced Printing for Microelectronic Packaging

The concept of dispensing a wide range of materials in three dimensions presents a potential change in electronic packaging. This article covers the concept of combining dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits.

Reliability Study of Bottom Terminated Components

This article series discusses bottom terminated components (BTC), and the stress and strain on these components when it comes to solder joints. In Part 1, the authors look at the impact of large voids at the thermal pads of BTC components and their impact on solder joint reliability.

How to Streamline PCB Thermal Design

Thermal issues with a PCB design are mostly determined during the component selection and layout phases. John Parry of Mentor Graphics discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.

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Co-owner Philip Kazmierowicz on New Role as KIC President

05/23/2019 | Nolan Johnson, I-Connect007
KIC is one of the leaders in reflow and thermal process control and smart oven technologies. On March 25, 2019, KIC announced that Philip Kazmierowicz, company co-owner, would take on the position of president. Nolan Johnson took that opportunity to sit down with Kazmierowicz in his Oregon-based R&D lab to discuss KIC's history and his plans for the future of the company.

Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 2)

05/08/2019 | Greg Smith, BlueRing Stencils
In the first part of this two-part article, Greg Smith talks about a study wherein a test vehicle was created to show transfer efficiency over a wide array of area ratios. Part 2 discusses the results of the experiment, including discussions of the different SEM results featuring the paste transfer efficiencies of each material, to better understand how the aperture wall surface smoothness compares to SMT stencil performance.

Catching up With Darrel Yarbrough of YES

05/07/2019 | Dan Beaulieu, D.B. Management Group
Yarbrough Electronic Sales (YES) is one of the fastest growing contract manufacturers in the Southwest. As people get to know them better, they are becoming the go-to company in their area. In this interview, long-time industry veteran Darrel Yarbrough, owner of YES, provides a background about the company, its capabilities, and his outlook for the industry.



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